Locating Features for Self-Piercing Riveting on Brittle Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of accurately locating self-piercing rivet installation sites in high-volume production settings, particularly when working with brittle or low-toughness materials like carbon fiber composites, where traditional methods struggle due to limited ductility and deformation capabilities.
Innovation Solution
Incorporating a dimpled substrate with preformed exterior and interior profiles and various locating features such as surface texturing, laser marking, or chemical etching to identify the precise location for self-piercing rivet installation, allowing for accurate positioning of the rivet through an installation tool.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-piercing rivet technology is used to join brittle materials like carbon fiber composites, then high production volume and automation are achieved, but accurate location identification of rivet installation sites becomes difficult
Solution Approach 1:
The patent applies preliminary action by pre-forming locating features (such as dimples, notches, or surface markings) on the substrate before the riveting process. These features are created during substrate manufacturing or preparation, enabling automated systems to easily detect and locate rivet installation sites without adding complexity to the high-volume production process.
Solution Approach 2:
The patent introduces an intermediary locating feature that mediates between the brittle substrate and the self-piercing rivet system. These features serve as detection markers that automated vision systems or sensors can identify, bridging the gap between the substrate surface and the rivet installation point without requiring direct measurement on the brittle material itself.
2Difficulty of detecting and measuring
If traditional joining methods are used on brittle materials, then location identification is easier, but the materials cannot undergo the necessary deformation to create mechanical interlock
Solution Approach 1:
The patent segments the substrate surface into distinct regions: the locating feature area and the rivet installation area. The locating feature (such as a dimple or notch) is separated from but associated with the button formation zone, allowing automated systems to identify the installation site without interfering with the deformation process needed for mechanical interlock.
Solution Approach 2:
The patent applies local quality by creating specific localized features (dimples, notches, surface markings) at predetermined rivet locations while leaving the surrounding substrate material intact for button formation. This localized modification enables detection without compromising the overall structural integrity or deformation capability of the brittle material.
3Manufacturing precision
If locating features are added to identify rivet sites, then positioning accuracy improves, but device complexity increases
Solution Approach 1:
The patent merges the locating feature creation with existing substrate manufacturing or preparation processes. Instead of adding separate equipment or complex detection systems, the locating features (dimples, notches, markings) are integrated into the substrate fabrication workflow, maintaining positioning accuracy while avoiding additional device complexity.
Solution Approach 2:
The patent enables the substrate to self-identify rivet locations through inherent features (such as pre-formed dimples or notches created during substrate manufacturing). The substrate essentially marks its own installation points, eliminating the need for external detection equipment or complex positioning systems.
Data Source
AI summary
A method includes identifying a location of a locating feature disposed on an exterior profile of a lower substrate, the locating feature configured to identify a specified location of the exterior profile, positioning a self-piercing rivet along an upper substrate according to the identified location of the locating feature, and installing the self-piercing rivet through the upper substrate and into the lower substrate.