Location-Based Power Via Diameters for Balanced PCB Current
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Solution Overview
Problem
Current imbalances in current and voltage distribution across electrical interconnects in electronic devices lead to performance degradation, electromigration, and uneven heat generation due to varying distances from power sources, which are not effectively addressed by increasing interconnects.
Innovation Solution
Varying the diameters of power vias based on their location to adjust resistances and offset current imbalances, with larger diameters closer to power sources and smaller diameters farther away, thereby equalizing current flow across interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniform diameter power vias are used across the PCB, then manufacturing is simplified, but current and voltage imbalances occur leading to performance degradation and electromigration
Solution Approach 1:
The patent applies local quality by varying the diameter of power vias based on their specific location within the PCB. Power vias closer to the array of interconnects have larger diameters to accommodate higher current density, while vias farther away have smaller diameters. This localized differentiation optimizes current distribution and prevents electromigration without requiring complete redesign of the manufacturing process.
Solution Approach 2:
The patent changes the physical parameter of via diameter to address current distribution issues. By adjusting the diameter parameter of power vias based on their location, the patent modifies the electrical resistance and current-carrying capacity of each via, thereby achieving more uniform current and voltage distribution across the array of interconnects.
2Reliability
If more power vias are added to increase current capacity, then current distribution improves, but device complexity and manufacturing cost increase
Solution Approach 1:
Rather than uniformly increasing the number or size of all power vias, the patent applies local quality by selectively enlarging only those vias that are positioned closer to the array of interconnects. This targeted approach addresses current distribution non-uniformity without proportionally increasing overall device complexity or manufacturing cost.
3Power
If larger diameter vias are used throughout, then current carrying capacity increases, but manufacturing precision requirements and material usage increase
Solution Approach 1:
The patent applies local quality by assigning different via diameters to different regions of the PCB based on current density requirements. This eliminates the need to use uniformly large vias throughout the entire board, thereby maintaining necessary current carrying capacity in critical areas while reducing manufacturing precision requirements and material usage in less critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces current and voltage imbalances, prevents electromigration, and improves heat dissipation by optimizing current distribution through controlled via resistances.
Implementation Method 1
The power vias comprise bores (holes) that extend along a thickness dimension of the PCB (perpendicular to the lateral dimensions) into which conductive material such as copper has been disposed (e.g., by plating a thin layer on interior surfaces of the bore) to form a conductive path from the power planes to the PCB connectors.
Implementation Method 2
Varying the diameters of power vias based on their location to adjust resistances and offset current imbalances
Data Source
AI summary
An electronic device may comprise a printed circuit board (PCB) and a power source and processing circuitry mounted to the PCB. The PCB comprises one or more power planes and a plurality of power vias electrically connected to the power planes. The power sources are electrically connected to the power planes. The processing circuitry is electrically connected to the plurality of power vias through a plurality of interconnects. Respective diameters of the plurality of power vias vary based on location.