Lockable Bond Head Modules for Heavy Wire Stability
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Solution Overview
Problem
Conventional bonding apparatuses for large wires face issues with instability during wire bonding due to insufficient rigidity, unreliable wire cutting, and unreliable bond strength testing, particularly when dealing with wires of varying sizes and materials.
Innovation Solution
A bonding apparatus comprising a first module drivable along a linear axis with a second module slidably mounted, featuring a coupling mechanism for locking and unlocking positions, a wire cutter, and a bonding tool, allowing precise control during bonding and cutting, and an integrated force sensor for real-time bond testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexural disk is used to provide flexible support for the bonding tool, then the cutter can move relative to the bonding tool for wire cutting, but the bonding tool has insufficient rigidity during wire bonding operations
Solution Approach 1:
The bonding apparatus is divided into two separate modules: a first module for wire cutting and a second module for bonding operations. This segmentation allows each module to be optimized independently - the first module can provide flexibility for cutting while the second module maintains rigidity for stable bonding, resolving the contradiction between flexibility and rigidity requirements.
2Productivity
If the cutter is rigidly mounted to the bond head, then the cutter can cut the wire effectively, but the cutter may damage hard surfaces such as the substrate
Solution Approach 1:
The wire cutting function is separated from the bonding head into a独立的 first module. This allows the cutter to be positioned and controlled independently, enabling effective wire cutting while preventing damage to the substrate through separate control of cutting depth and position.
Solution Approach 2:
The first module acts as an intermediary between the bonding head and the wire cutting operation. It provides a dedicated platform for the cutter with independent positioning capabilities, serving as a mediator that enables cutting functionality while protecting the main bonding head and substrate from damage.
3Ease of manufacture
If a universal elastic mount is used for the cutter, then the design is simplified, but the peak force limit varies with material and cannot accommodate wires of different types and sizes
Solution Approach 1:
The first module is designed with dynamic positioning capabilities that allow the cutter's peak force limit and positioning to be adjusted based on the specific wire type and size being processed. This dynamic adaptability enables a single design to handle various wire specifications effectively.
Solution Approach 2:
The system allows for parameter changes in the first module's positioning and force application based on the wire being processed. By adjusting parameters such as cutter position, approach speed, and peak force limit according to wire specifications, the system maintains both design simplicity and adaptability to different wire types.
Data Source
Figure 1~2
Figure 3~5
Figure 6A~6B
AI summary
A bonding apparatus (10) for bonding a length of wire comprises a first module (14) which is drivable along a linear axis towards and away from a bonding point and a second module (16) slidably mounted to the first module (14). A wire cutter (36) is mounted to the first module (14) and a bonding tool (32) is mounted to the second module (16). A coupling mechanism is operative to lock the second module (16) in fixed relative position to the first module (14), and to unlock the second module (16) from its fixed relative position to the first module (14) so that the second module (16) is slidable relative to the first module (14) in directions parallel to the linear axis.