Locking Card Reinforcement for Semiconductor Conductor Soldering
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Solution Overview
Problem
The reliability of soldering connections between aluminum wires/bands and inner frame leads in semiconductor power devices is compromised due to heat stress, moisture, and process quality fluctuations, leading to electrical failures.
Innovation Solution
A reinforcing structure and method that involves forming through holes in the soldering area of the inner frame lead, soldering the conductor between these holes, and using locking cards to clamp the conductor firmly onto the inner frame lead, ensuring a secure electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional soldering methods are used to connect aluminum wires/bands to inner frame leads, then the manufacturing process is simple, but the soldering reliability deteriorates under heat stress and moisture
Solution Approach 1:
The inner frame lead is divided into multiple segments with through-holes created at specific locations. The locking card is segmented into a pressing part and a locking part, allowing independent functions for clamping and securing the conductor, thereby improving reliability without excessive complexity
Solution Approach 2:
A locking card is introduced as an intermediary component between the conductor and the inner frame lead. This locking card with through-holes and locking parts provides enhanced mechanical interlocking and electrical connection reliability, accepting the increased structural complexity as a trade-off for improved soldering reliability under harsh conditions
2Reliability
If the conductor is firmly clamped to prevent stripping, then the electrical connection reliability is improved, but the manufacturing complexity increases
Solution Approach 1:
Through-holes are pre-formed in the inner frame lead before conductor soldering. The locking card is pre-assembled with locking parts that engage with these through-holes, allowing the clamping action to be performed in advance or during a single integrated step, improving electrical connection reliability while managing manufacturing complexity through process integration
Solution Approach 2:
The locking card combines multiple functions into a single component: it provides mechanical clamping through the pressing part, electrical connection through the integrated structure, and securing through the locking parts that engage with through-holes. This merging of functions improves ease of manufacture by reducing the number of separate components and assembly steps
3Reliability
If through holes are added to the inner frame lead for locking cards, then the conductor stripping is prevented, but the manufacturing precision requirements increase
Solution Approach 1:
Through-holes are created only at specific local positions on the inner frame lead where locking cards need to engage, rather than uniformly across the entire structure. This localized approach prevents conductor stripping at critical points while minimizing the overall impact on manufacturing precision requirements
Solution Approach 2:
The design allows for flexibility in the dimensions and positioning parameters of through-holes and locking card features. By optimizing these parameters, the manufacturing precision requirements are reduced while still achieving the goal of preventing conductor stripping and improving connection stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents conductor stripping, enhances the reliability of the electrical connection, and improves the overall performance of semiconductor power devices by maintaining a stable connection under harsh conditions.
Implementation Method 1
the locking card includes a pressing part, a locking part overhangs outwards from the pressing part, the pressing part is pressed on the conductor, and the locking part penetrates through the inner frame lead and is clamped on the side of the inner frame lead deviating from the conductor
Data Source
AI summary
The present invention provides a structure and a method of reinforcing a conductor soldering point of a semiconductor device. The structure includes an inner frame lead, a soldering area arranged on the surface of the inner frame lead, a conductor soldered in the soldering area, and a locking card including a pressing part, a locking part overhangs outwards from the pressing part pressed on the conductor. The locking part penetrates through the inner frame lead and is clamped on the side of the inner frame lead deviating from the conductor. According to the present invention, the conductor soldered on the inner frame lead is firmly clamped on the inner frame lead through the locking card to effectively avoid the stripping condition of the conductor and the inner frame lead, reinforce the electrical connection of the conductor and the inner frame lead, and improve the reliability of the semiconductor device.