Locking-Recess Clip Packaging to Prevent Encapsulant Delamination
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Solution Overview
Problem
Delamination of package constituents deteriorates the mechanical and electrical reliability of electronic packages.
Innovation Solution
A clip with at least one locking recess is used to connect an electronic component with a carrier, where the locking recess accommodates encapsulant material to lock the encapsulant and the clip together, enhancing mechanical and electrical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional clip without locking recesses is used to connect an electronic component with a carrier, then the device complexity is low, but delamination occurs between the clip and encapsulant, deteriorating mechanical and electrical reliability
Solution Approach 1:
The clip surface is segmented into multiple locking recesses distributed across the encapsulation surface. Each recess acts as an independent anchoring point, collectively preventing delamination while maintaining overall structural simplicity. The segmentation of the flat surface into recessed zones creates mechanical interlocking without requiring complex overall redesign.
Solution Approach 2:
Locking recesses are strategically positioned in specific local regions of the clip surface where encapsulant contact occurs. The recesses create localized mechanical interlocking zones that prevent delamination at critical interfaces, while the rest of the clip structure remains simple and unchanged.
2Temperature
If the clip surface is made completely exposed to promote heat removal, then thermal performance improves, but adhesion between the clip and encapsulant deteriorates
Solution Approach 1:
The clip surface is differentiated into two functional zones: locking recesses that provide adhesion through encapsulant interlocking, and exposed flat surfaces that maintain thermal contact with the encapsulant for heat removal. This local quality differentiation resolves the contradiction between adhesion and thermal performance.
Solution Approach 2:
The clip surface is segmented into adhesion-promoting recessed zones and thermally-active exposed zones. The recesses accommodate encapsulant material for mechanical bonding, while the remaining exposed surfaces maintain direct thermal contact, allowing both adhesion and heat removal functions to coexist.
3Strength
If locking recesses are added to the clip to prevent delamination, then mechanical integrity improves, but manufacturing complexity increases
Solution Approach 1:
The locking recesses are pre-formed on the clip surface before final assembly and encapsulation. This preliminary action integrates the adhesion-enhancing features into the clip manufacturing process itself, avoiding the need for post-assembly modifications and reducing overall manufacturing complexity despite the added functional complexity.
Data Source
AI summary
A method of manufacturing a package includes: connecting an electronic component with a carrier by a clip having at least one locking recess; partially encapsulating the clip by an encapsulant so that at least part of a main surface of the clip remains partially exposed with respect to the encapsulant; and locking the encapsulant and the clip by accommodating material of the encapsulant in the at least one locking recess.