Log Defect Detection Using Geometry and Cut-Surface Imaging
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Solution Overview
Problem
The existing methods for detecting defects in wood during log processing require high metrological effort, which hinders efficient timber yield optimization.
Innovation Solution
A method that combines log geometry measurement with imaging inspection to determine defects in wood without requiring post-cutting profile measurement, using a profile sensor to generate a log model and an imaging sensor to capture and analyze inspection images, projecting defect information onto the model for spatially resolved defect determination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If profile measurement is performed both before and after log cutting to detect defects, then measurement precision and reliability are improved, but metrological effort and device complexity increase significantly
Solution Approach 1:
The patent uses imaging sensors to capture images of the processing surface after cutting, creating a visual copy of the defect information. This image-based approach replaces the need for complex post-cutting profile measurements, maintaining defect detection capability while significantly reducing metrological effort and device complexity
Solution Approach 2:
The patent performs profile measurement before cutting to obtain log geometry information, and uses this preliminary data combined with post-cutting images to determine defect positions. By doing the measurement preparation in advance and using image data instead of full profile measurement after cutting, the system reduces overall metrological effort while maintaining measurement precision
2Reliability
If comprehensive profile measurement is conducted after log cutting to identify all defects, then defect detection reliability is improved, but processing time and productivity are reduced
Solution Approach 1:
The patent replaces mechanical profile measurement systems with optical imaging sensors to detect defects on the processing surface. This substitution maintains reliable quality inspection through image analysis while significantly reducing processing time and increasing productivity, as imaging is much faster than comprehensive mechanical scanning
3Measurement precision
If multiple sensors and comprehensive scanning are used to detect defects, then measurement precision is improved, but ease of operation and process simplicity deteriorate
Solution Approach 1:
The patent merges the use of pre-cutting profile measurement data with post-cutting imaging data into a unified defect detection process. By combining these two data sources and using the log geometry from preliminary measurement with images from the processing surface, the system achieves accurate defect position determination while simplifying the overall process compared to using multiple independent measurement systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable quality inspection and high timber yield with reduced metrological effort by accurately determining defect positions and optimizing sawing solutions based on log geometry and imaging data.
Implementation Method 1
A) measurement of the profile of the log and determination of a log geometry of the log
Implementation Method 2
C) imaging inspection of the log processed by cutting at least on the processing surface and capturing of at least one inspection image
Data Source
AI summary
A method for detecting defects in the wood and/or properties of the defects in the wood during the processing of a log, having the steps of: A) measuring a profile of the log (1) and determining a log geometry of the log; B) processing the log (1) by cutting so as to produce a processing surface (8) along a log axis of the log (1); C) imaging inspection of the log (1) processed by cutting at least on the processing surface (8) and determination of at least one inspection image (14); and D) using the inspection image (14) from method step C) and the log geometry from method step A) as a basis for spatially resolved determination of a defect (10) in the wood and/or a property of the defect in the wood on the log processed by cutting.