Logic Cell Interconnect Layout to Prevent Short Circuits
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Solution Overview
Problem
The challenge in semiconductor device manufacturing is the risk of short circuits due to the formation of fine patterns, which can lead to defects such as shorts between electrodes or wires, particularly in the context of down-sizing and high integration of electronic devices.
Innovation Solution
A semiconductor device design featuring logic cells with conductive lines and power lines arranged in a specific pattern, where second conductive lines cross first conductive lines and power lines, and third conductive lines cross second conductive lines, with separation areas positioned in a zigzag form adjacent to the logic cell boundaries, allowing for connection points except at separation areas to prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fine patterns are formed to achieve down-sizing and high integration, then device integration density is improved, but the risk of short circuits between electrodes or wires increases
Solution Approach 1:
The conductive lines are segmented into multiple layers (first conductive lines, second conductive lines, third conductive lines) with insulating layers between them. This segmentation allows for higher integration density while maintaining reliable electrical connections and preventing short circuits through the layered structure.
Solution Approach 2:
The patent transitions from planar patterning to three-dimensional layered conductive line structures. By stacking conductive lines in multiple layers separated by insulating layers, the design achieves higher integration density while the vertical separation prevents short circuits that would occur in two-dimensional fine patterning.
2Adaptability or versatility
If conductive lines are arranged in a grid pattern with multiple crossings, then connection points (hit points) are increased improving connectivity, but the complexity of the layout increases
Solution Approach 1:
The conductive lines are divided into three separate layers (first, second, and third conductive lines) with insulating layers between them. This segmentation allows for multiple connection points and high connectivity while simplifying the layout process by organizing crossings in the vertical dimension rather than requiring complex two-dimensional routing.
Solution Approach 2:
The patent uses three-dimensional layered architecture to achieve multiple connection points. Instead of increasing two-dimensional line density which would increase layout complexity, the design places conductive lines in multiple layers, allowing crossings and connections to occur naturally in the vertical dimension while maintaining simple planar projections.
Data Source
AI summary
A semiconductor device includes logic cells including first conductive lines, first power lines, second conductive lines on the first conductive lines, first power lines, and third conductive lines and second power lines on the second conductive lines. The first conductive line, first power line, third conductive line, and second power line extend in a first direction, the second conductive line extends in a second direction crossing the first direction, the second conductive line includes separation areas near a boundary of the logic cell, the separation areas are alternately positioned at a lower side and an upper side based on the boundary of the logic cell in zigzag form. The first conductive lines and the second conductive lines overlap first hit points to which the first conductive lines and the second conductive lines can be connected, except for a point adjacent to the separation area of the second conductive line.