Logic Circuitry Package for Print Component Communication

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Solution Overview

Problem

Current print apparatus systems face challenges in efficiently communicating and managing data between replaceable print components, particularly in terms of sensor information and resource management, due to limitations in communication protocols and resource constraints within these components.

Innovation Solution

The implementation of a logic circuitry package that utilizes the I2C protocol to facilitate communication between master and slave ICs, enabling data exchange and sensor information management through a bus system, with features like address reconfiguration and secure microcontroller functions to enhance compatibility and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional communication protocols are used in replaceable print components, then device complexity is reduced, but communication efficiency and data management capability deteriorate

Engineering Contradiction:
Improvecommunication efficiencyVSAvoiddevice complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent introduces an intermediary translation layer between the simple sensor hardware and the complex I2C protocol requirements. This intermediary component translates basic sensor readings into standardized I2C communication format, enabling efficient data exchange without requiring complex processing in the replaceable cartridge itself.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs parameter changes by dynamically adjusting communication addresses and data formats based on the specific cartridge type and sensor configuration. This allows the system to optimize communication efficiency for different scenarios while maintaining compatibility through standardized I2C protocol parameters.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If resource constraints within replaceable components are accepted, then ease of manufacture is improved, but communication capability and sensor information management deteriorate

Engineering Contradiction:
Improvecommunication reliabilityVSAvoidease of manufacture
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent uses copying by implementing software-based address reconfiguration that replicates the functionality of multiple physical address lines. This allows a single physical interface to support multiple communication addresses, improving reliability without adding complex hardware components that would difficulty manufacture.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The I2C protocol implementation provides multi-functionality by enabling the same communication interface to handle multiple sensors, different data types, and various communication modes within the resource-constrained cartridge environment, thereby improving reliability without increasing manufacturing complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If address reconfiguration features are implemented, then adaptability and compatibility are improved, but device complexity increases

Engineering Contradiction:
ImprovecompatibilityVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements dynamic address reconfiguration that allows communication addresses to be changed at runtime based on the detected cartridge type and configuration. This dynamic adaptation enables a single hardware design to work with multiple cartridge variations, improving compatibility without requiring multiple fixed-address hardware variants.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentEP3844000B1Logic circuitry package
Publication Date: 2023.04.12 HEWLETT PACKARD DEVELOPMENT COMPANY LP
  • EP3844000B1 patent drawingFigure 1~3
  • EP3844000B1 patent drawingFigure 4A~4B
  • EP3844000B1 patent drawingFigure 4C~4D

AI summary

A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit, and a logic circuit having a communication address to communicate with the print apparatus logic circuit. The logic circuit is configured to detect, via the interface, communications that include an other communication address. The logic circuit is configured to respond, via the interface, to a command series directed to the logic circuit that include the communication address of the logic circuit, based on the detected communications.