Logic Circuitry Package for Print Apparatus Communication

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Solution Overview

Problem

Current 2D and 3D printing systems face challenges in efficiently communicating and managing data between replaceable print apparatus components and the print apparatus, particularly in terms of sensor information and resource management, due to limitations in communication protocols and resource constraints of these components.

Innovation Solution

The implementation of a logic circuitry package that utilizes the I2C protocol to facilitate communication between the print apparatus and replaceable components, enabling data exchange, sensor information monitoring, and resource management through a master-slave IC configuration, with features like address reconfiguration and secure microcontroller functions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional communication protocols are used between replaceable print apparatus components and the print apparatus, then basic data exchange is possible, but communication efficiency and resource management are insufficient

Engineering Contradiction:
Improvecommunication efficiencyVSAvoidresource management complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent introduces an intermediary microcontroller unit (MCU) that mediates communication between the I2C interface and the print apparatus logic circuit. This intermediary handles protocol conversion, data buffering, and resource management, thereby improving communication efficiency while abstracting away the complexity of resource management from the main system.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces traditional parallel communication interfaces with the I2C serial communication protocol, which uses fewer physical pins and provides more efficient data transmission. This substitution reduces the complexity of physical connections while improving communication speed and resource utilization through standardized serial protocols.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If more sensor functions are integrated into replaceable components, then monitoring capabilities improve, but the complexity of the component increases

Engineering Contradiction:
Improvesensor information accuracyVSAvoidcomponent structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple sensor functions (ink level sensing, temperature sensing, pressure sensing) into a single integrated logic circuitry package that communicates through a unified I2C interface. This merging approach allows multiple measurement functions to coexist in a compact form factor, improving monitoring capabilities without proportionally increasing component complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The logic circuitry package is designed with universal I2C communication capabilities that can handle multiple sensor types and functions through a single interface. This multi-functional design allows the same hardware package to support various sensing operations, reducing overall system complexity while enhancing measurement precision across different parameters.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If multiple replaceable components communicate with the print apparatus, then functionality is enhanced, but data management and addressing become more complex

Engineering Contradiction:
Improvecomponent compatibilityVSAvoidaddressing and data management complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent utilizes the I2C protocol's addressable architecture where each replaceable component can be assigned a unique address parameter. This parameter-based addressing system allows the print apparatus to selectively communicate with specific components, managing data flow and reducing complexity through standardized address allocation and protocol-handled data routing.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP3829883B1Logic circuitry package
Publication Date: 2023.03.08 HEWLETT PACKARD DEVELOPMENT COMPANY LP
  • EP3829883B1 patent drawingFigure 1~3
  • EP3829883B1 patent drawingFigure 4A~4B
  • EP3829883B1 patent drawingFigure 4C~4D

AI summary

A replaceable print apparatus component includes a logic circuitry package. The logic circuitry package includes a first interface to communicate with a print apparatus logic circuit, and a logic circuit. The logic circuit is configured to detect a first response provided by an other logic circuitry package of an other replaceable print apparatus component in response to a first command directed to the other replaceable print apparatus component by the print apparatus logic circuit. The logic circuit is also configured to receive, via the first interface, a second command by the print apparatus logic circuit, and transmit, via the first interface, a second response to the second command based on the detected first response.