Programmable Logic Die Power-Thermal Control With Dynamic Voltage Scaling
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Solution Overview
Problem
Traditional programmable fabric-based packages face challenges in dynamically adjusting power states and thermal levels across multiple die, leading to inefficient power usage and potential overheating due to static control methods.
Innovation Solution
Implementing control circuitry within the programmable fabric-based package to monitor power and thermal data from sensors, allowing for dynamic adjustment of die voltage and frequency based on collected data to optimize power and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If static control methods are used for power states and thermal levels, then device complexity is reduced, but power efficiency deteriorates and thermal management becomes insufficient
Solution Approach 1:
The system implements self-service through automated power and thermal management where control circuitry continuously monitors power consumption and thermal data from multiple die, then autonomously adjusts operating conditions without external intervention. This enables dynamic optimization of power efficiency while managing the complexity internally through self-regulating mechanisms.
Solution Approach 2:
The patent applies dynamics by transitioning from static control methods to dynamic adjustment of power states and thermal levels. The control circuitry continuously adapts operating conditions based on real-time monitoring of power consumption and thermal data, allowing the system to respond to changing workloads and environmental conditions, thereby improving power efficiency despite increased control complexity.
2Adaptability or versatility
If static control methods are used for power states, then ease of operation is maintained, but adaptability to varying power and thermal conditions deteriorates
Solution Approach 1:
The system implements feedback mechanisms where control circuitry continuously monitors power consumption and thermal data from sensors on multiple die, then uses this feedback to dynamically adjust operating conditions. This closed-loop control enables the system to adapt to varying power and thermal conditions while maintaining ease of operation through automated decision-making algorithms.
Solution Approach 2:
The patent applies dynamics by enabling the system to adapt its power states and thermal management strategies in real-time based on monitored conditions. The control circuitry dynamically adjusts operating parameters to match actual workload and thermal environments, providing versatility without requiring user intervention to maintain operational simplicity.
3Reliability
If worst case scenario power management is used, then reliability is improved, but power efficiency deteriorates due to excess power usage
Solution Approach 1:
The patent resolves this contradiction by implementing dynamic power management that adjusts power states based on actual operating conditions rather than maintaining fixed worst-case settings. The control circuitry monitors power consumption and thermal data in real-time, enabling the system to operate reliably at optimal power levels for each specific condition, thereby improving power consumption efficiency while maintaining reliability.
Solution Approach 2:
The system applies parameter changes by dynamically modifying power states and operating conditions based on monitored data. Instead of maintaining static worst-case parameters, the control circuitry adjusts voltage, frequency, and power distribution parameters in real-time to match actual workload requirements, ensuring reliable operation while eliminating excess power consumption.
Data Source
AI summary
Systems or methods of the present disclosure may provide a programmable logic device including one or more power monitors and one or more thermal sensors. The programmable logic device may include control circuitry that may receive power data and thermal data for multiple die of the programmable logic device, and may implement one or more response based on the thermal and power data.