Logic Circuit Package for Thermal Print Material Level Sensing

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Solution Overview

Problem

Existing printing systems face challenges in accurately determining the level of print materials within replaceable print apparatus components, particularly due to variations in sensor cell readings and the need for reliable communication protocols to ensure proper functionality and compatibility between print apparatus and replaceable components.

Innovation Solution

The implementation of a logic circuitry package with integrated heater and temperature sensor cells, utilizing I2C communication protocol, which enables precise print material level sensing by calculating delta values and first derivatives to compensate for sensor variations, and allows for secure and authenticated communication between print apparatus and components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional sensor cells are used for print material level sensing, then the device structure is simple, but measurement precision deteriorates due to sensor cell reading variations

Engineering Contradiction:
Improveprint material level sensing accuracyVSAvoidlogic circuitry complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The system implements feedback by continuously monitoring temperature sensor cell readings and using heater cells to actively control the thermal environment. The logic circuitry adjusts heater activation based on detected temperature variations, creating a closed-loop system that compensates for sensor drift and environmental changes, thereby improving measurement precision.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The invention changes the operating parameters of the sensor system by introducing controlled thermal variations through heater cells. By periodically heating the sensor environment and measuring the resulting temperature-dependent resistance changes in the sensor cells, the system extracts level information while compensating for absolute temperature drift, thus improving measurement accuracy.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If I2C communication protocol is implemented for secure communication, then communication security is improved, but device complexity increases

Engineering Contradiction:
Improvecommunication securityVSAvoidcommunication interface complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The logic circuitry package implements a universal I2C communication interface that serves multiple functions: authenticated data transmission, device identification, capability negotiation, and secure key exchange. This multi-functional approach consolidates what would otherwise require separate dedicated circuits for each function, managing complexity while enhancing reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Measurement precision

If heater and temperature sensor cells are integrated for compensation, then measurement precision is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvesensor reading accuracyVSAvoidassembly complexity
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The invention merges the heater cells and temperature sensor cells into a single integrated logic circuitry package that is co-installed with the print material container. This consolidation ensures precise spatial relationships between thermal control elements and sensors, improving measurement accuracy while simplifying the overall assembly process compared to distributed thermal management approaches.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides reliable and accurate print material level detection, enhances communication security, and ensures compatibility and reliability between print apparatus and replaceable components, reducing errors and improving the operational health of the printing system.

Implementation Method 1

a logic circuitry package with integrated heater and temperature sensor cells

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

utilizing I2C communication protocol, which enables precise print material level sensing by calculating delta values and first derivatives to compensate for sensor variations

Methodology Applied
Scientific EffectTemperature-dependent resistance: Thermistor

Data Source

PatentUS11351791B2Logic circuitry package
Publication Date: 2022.06.07 HEWLETT PACKARD DEVELOPMENT COMPANY LP
  • US11351791B2 patent drawing
  • US11351791B2 patent drawing
  • US11351791B2 patent drawing

AI summary

A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit. The logic circuit is configured to receive, via the interface, a plurality of first requests in a heater disabled mode, each first request corresponding to a different sensor ID of a plurality of sensor IDs; transmit, via the interface, a first digital value in response to each first request; receive, via the interface, a plurality of second requests in a heater enabled mode, each second request corresponding to a different sensor ID of the plurality of sensor IDs; and transmit, via the interface, a second digital value in response to each second request. Delta values corresponding to a difference between the first digital value and the second digital value for each different sensor ID of the plurality of sensor IDs are indicative of a print material level.