Long-Edge FPC Bonding Layout for Narrow-Bezel Displays

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Solution Overview

Problem

Existing display technologies face challenges in achieving narrow bezels while ensuring high yield rates and avoiding issues such as bending deviation and warping of flexible printed circuits (FPCs) during the bonding process.

Innovation Solution

The redesign of flexible printed circuits with aligned and overlapped bonding portions, coupled with a conductive rubber layer and strategic groove designs, to distribute stress uniformly and prevent warping, along with wedge-shaped edges to avoid functional holes, enhances the bonding process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the FPC bonding portion is designed with large length to ensure sufficient bonding area, then the bonding reliability is improved, but the bending deviation and warping increase during the bonding process

Engineering Contradiction:
Improvebonding reliabilityVSAvoidbending precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by creating a groove structure at a specific location (first position) within the bonding portion, rather than uniformly distributing features throughout. This localized groove design allows stress concentration and distribution control at a critical point during bending, preventing warping while maintaining overall bonding reliability. The groove is positioned to optimize both bonding area and bending behavior simultaneously.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The bonding portion is segmented by introducing a groove that divides the continuous bonding structure into regions. This segmentation allows different parts of the bonding portion to have different mechanical properties - the groove creates a stress distribution pattern that prevents warping while maintaining sufficient bonding area. The segmented structure enables controlled bending behavior without compromising reliability.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If the FPC bonding portion is designed with short length to reduce warping, then the bending precision is improved, but the bonding area is insufficient reducing reliability

Engineering Contradiction:
Improvebending precisionVSAvoidbonding reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent introduces a dimensional feature (groove) within the bonding portion that extends in a direction perpendicular to the bending direction. This adds a third dimension to the bonding structure, allowing stress distribution control without reducing the bonding area in the bending plane. The groove creates additional stress management pathways that prevent warping while maintaining sufficient bonding surface area for reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If the FPC is designed with complex structure to distribute stress, then the warping is reduced, but the manufacturing complexity increases

Engineering Contradiction:
Improvewarping controlVSAvoidFPC structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Rather than making the entire FPC structure complex, the patent applies complexity only locally at the first position within the bonding portion. The groove structure is a simple, localized feature that provides stress distribution benefits without requiring complex overall FPC design. This localized approach maintains manufacturing simplicity while achieving warping control through targeted structural modification.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP3996073B1Display apparatus
Publication Date: 2025.11.12 BOE TECHNOLOGY GROUP CO LTD
  • EP3996073B1 patent drawingFigure 1
  • EP3996073B1 patent drawingFigure 2
  • EP3996073B1 patent drawingFigure 3

AI summary

The present disclosure relates to the technical field of display, and discloses a display device. The purpose of the disclosure is to provide an improved solution for a display product with an FPC bonding to the long edge of a module, and improve the yield rate of the display product. A display device includes: a display module having a module body and a first bonding portion located on one side of a first long edge of the module body, where the first bonding portion is bent to the back face of the module body; and a first flexible printed circuit located on the back face of the module body, where the first flexible printed circuit has a second bonding portion, and the second bonding portion is fixedly connected to the first bonding portion of the display module; the length of the second bonding portion along an extending direction of the first long edge is substantially identical with the length of the first bonding portion along the extending direction of the first long edge.