Loop Antenna Wireless Semiconductor Storage Cost Reduction

The patent replaces the mechanical winding device with a PCB fabrication process. The loop antenna is formed by patterning conductive traces on a substrate using photolithography and etching techniques, eliminating the need for mechanical winding equipment. This substitution of mechanical manufacturing with semiconductor fabrication processes directly reduces manufacturing cost and equipment complexity.

The patent uses a planar pattern copy of the loop antenna design directly transferred onto the PCB substrate through photolithography. Instead of physically winding wire to create the antenna, the design is copied as a 2D pattern that is then etched into the substrate, significantly simplifying the manufacturing process and reducing equipment requirements.

The patent replaces time-consuming mechanical winding operations with parallel PCB fabrication processes. Multiple loop antenna structures can be fabricated simultaneously on a single substrate using batch photolithography and etching, dramatically increasing production throughput and reducing per-unit manufacturing time compared to sequential winding operations.

The patent performs preliminary patterning and trace formation during the PCB fabrication process, which occurs in advance before final assembly. This preliminary creation of the loop antenna structure eliminates the need for time-consuming post-fabricration winding operations and allows for parallel production of multiple antennas.