Loop Conveyance Path for Display Manufacturing Yield
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Solution Overview
Problem
The manufacturing yield of display devices incorporating organic light emitting diodes (OLEDs) is reduced due to inefficiencies in the manufacturing process, particularly in the formation and processing of organic layers, electrodes, and sealing layers.
Innovation Solution
A manufacturing device with a main manufacturing line and a sub-line forming a loop conveyance path, equipped with evaporation devices, CVD devices, and dry etching devices, which allows for the sequential and precise formation of organic layers, electrodes, and sealing layers, including the use of inorganic insulating layers to enhance the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional linear manufacturing process is used, then the process is simple to operate, but the manufacturing yield is reduced due to inability to process multiple substrates simultaneously
Solution Approach 1:
The manufacturing device is divided into multiple independent processing units (evaporation device, CVD device, dry etching device) that can operate simultaneously on different substrates. Each unit is segmented as an independent module with its own processing chamber, allowing parallel operations that increase productivity without requiring complete system redesign
Solution Approach 2:
The manufacturing process transitions from a single-line sequential flow to a multi-dimensional parallel processing architecture. Substrates are distributed across multiple processing chambers arranged in different spatial dimensions, enabling simultaneous processing of multiple substrates at different stages of manufacturing
2Productivity
If multiple processing steps are performed sequentially on a single substrate, then the process control is simple, but the total processing time increases and productivity decreases
Solution Approach 1:
The manufacturing system maintains continuous productive action by ensuring that while one substrate is being processed in the evaporation device, another substrate is simultaneously being processed in the CVD device, and a third substrate is undergoing dry etching. This continuous utilization of processing capacity eliminates idle time and maximizes throughput
Solution Approach 2:
Substrates are prepared and positioned in advance in each processing chamber before the actual manufacturing step begins. The system pre-arranges the workflow so that when one processing step completes, the next substrate is already ready for immediate processing, eliminating waiting time
3Reliability
If individual processing devices are operated independently, then each device can be optimized for its specific function, but the overall process reliability decreases due to lack of coordination
Solution Approach 1:
The control system continuously monitors the status of each processing device and substrate position, providing real-time feedback to adjust processing parameters and coordinate device operations. This feedback mechanism ensures synchronized operation across all devices while maintaining the optimization benefits of independent device design
Solution Approach 2:
The control system is designed with universal functionality to manage multiple different types of processing devices (evaporation, CVD, dry etching) through a single integrated platform. This multi-functional controller coordinates all devices while maintaining their individual optimization, reducing the complexity of having separate control systems for each device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the manufacturing yield by enabling simultaneous processing of multiple substrates, reducing the risk of errors and allowing continuous operation even if individual devices fail, thereby enhancing the production efficiency and quality of display devices.
Implementation Method 1
an in-line first evaporation device which is located on a downstream side in a conveyance direction of the processing substrate relative to the preprocessing portion and has a plurality of evaporation chambers for forming an organic layer, an upper electrode and a cap layer on the lower electrode in order
Implementation Method 2
at least one first CVD device which is located on a downstream side of the first evaporation device and is provided for forming a first inorganic insulating layer of a sealing layer on the cap layer
Data Source
AI summary
According to one embodiment, a manufacturing device includes a main manufacturing line and a sub-line. The main manufacturing line includes a preprocessing portion, an in-line first evaporation device, a first CVD device for forming a first inorganic insulating layer of a sealing layer, a dry etching device for reducing a thickness of the first inorganic insulating layer, and a second CVD device for forming a second inorganic insulating layer of the sealing layer. The sub-line forms a detour which is different from the main manufacturing line as a conveyance path for conveying a processing substrate. The main manufacturing line and the sub-line form a loop conveyance path.