Loop Heat Pipe With Bendable Connecting Portion
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Solution Overview
Problem
Heat pipes used in high-performance electronic devices can become dislodged from heat-generating components due to impact or weight, hindering cooling efficiency, especially when mounted on lower surfaces of wiring substrates.
Innovation Solution
A loop heat pipe design comprising two heat pipe portions with evaporators, condensers, vapor tubes, and liquid tubes, connected by a bendable connecting portion that integrates with the condensers, allowing for efficient heat transfer and maintaining the heat pipe's position without additional fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat pipe is mounted on lower surface of wiring substrate, then cooling of heat-generating components is achieved, but heat pipe may be moved away from heat-generating components due to impact or weight
Solution Approach 1:
The patent merges the heat pipe structure with the wiring substrate by integrating the heat pipe into a recess formed in the wiring substrate. The heat pipe is positioned within the recess such that its outer peripheral surface is in contact with the inner peripheral surface of the recess, effectively combining two separate components into a unified structure that prevents displacement while maintaining cooling functionality.
Solution Approach 2:
The heat pipe is nested within the recess of the wiring substrate, with the condenser portion of the heat pipe fitting into the recess space. This nesting arrangement allows the heat pipe to be securely housed within the substrate structure, preventing it from being moved away due to impact or weight while still enabling effective heat dissipation.
2Stability of the object's composition
If heat pipe is fixed to wiring substrate, then position stability is improved, but additional fixation components increase device complexity
Solution Approach 1:
The patent eliminates the need for separate fixation components by merging the heat pipe structure with the wiring substrate through the recess integration. The heat pipe is held in position by the geometric constraint of the recess itself, rather than by additional fasteners or adhesive layers, thereby maintaining position stability while minimizing structural complexity.
Solution Approach 2:
The recess in the wiring substrate serves as a self-contained fixation mechanism. The heat pipe is held in position by the recess geometry alone, without requiring external fixation components. The structure is self-sufficient, using the recess walls to provide the necessary mechanical constraint to prevent heat pipe displacement.
3Adaptability or versatility
If loop heat pipe design with two circuits is used, then cooling coverage is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines two separate heat pipe circuits into a single integrated loop heat pipe structure. The first and second heat pipe portions share common components including the evaporator, condenser, vapor tube, and liquid tube, forming a unified loop configuration. This merging approach enables dual cooling coverage while simplifying manufacturing compared to assembling two separate heat pipe systems.
Solution Approach 2:
The loop heat pipe structure performs multiple cooling functions through its two circuits. The first heat pipe portion cools a first heat-generating component while the second heat pipe portion cools a second heat-generating component, with both circuits operating within a single integrated structure. This multi-functional design provides extensive cooling coverage without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The loop heat pipe effectively cools heat-generating components on both upper and lower surfaces of a wiring substrate, improving cooling efficiency and design flexibility by maintaining the heat pipe's position and enhancing heat dissipation through increased surface area.
Implementation Method 1
a first evaporator that vaporizes working fluid with heat of the first heat-generating component
Implementation Method 2
a first condenser that liquefies the working fluid vaporized by the first evaporator
Data Source
Figure 1A~1B
Figure 2
Figure 3~4
AI summary
A loop heat pipe (10) includes a first heat pipe portion (11) and a second heat pipe portion (12). The first heat pipe portion (11) includes a first evaporator (21), a first condenser (22), a first vapor tube (23), and a first liquid tube (24). The second heat pipe portion (12) includes a second evaporator (31), a second condenser (32), a second vapor tube (33), and a second liquid tube (34). The loop heat pipe (10) further includes a connecting portion (13) that connects the first condenser (22) and the second condenser (32).