Loop Heat Pipe Cooling System with Capillary Circulation
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Solution Overview
Problem
Traditional air cooling methods for IT devices face limitations in heat dissipation due to high power consumption, and liquid cooling systems risk refrigerant leakage and require reliable, costly pumps.
Innovation Solution
A heat-pipe heat dissipation system utilizing a loop heat pipe configuration with capillary structures and vacuum-pumping, eliminating the need for pumps by using capillary suction force for refrigerant circulation and ensuring no refrigerant leakage through quick connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a pump is used to drive refrigerant circulation in liquid cooling systems, then heat dissipation capability is improved, but reliability deteriorates due to motion parts requiring backup
Solution Approach 1:
The patent replaces the mechanical pump system with a capillary wick-based passive circulation system. The capillary wick structure utilizes surface tension forces to drive refrigerant circulation without mechanical moving parts, thereby eliminating the reliability issues associated with pump motion parts while maintaining effective heat dissipation capability.
Solution Approach 2:
The system enables self-service circulation where the capillary wick automatically drives refrigerant flow from the condenser back to the evaporator without external mechanical assistance. The refrigerant circulation is self-sustained through capillary forces, eliminating the need for powered pump components and their associated reliability concerns.
2Productivity
If a pump is used to drive refrigerant circulation, then heat dissipation capability is improved, but device complexity and cost increase due to required backup systems
Solution Approach 1:
The patent replaces the mechanical pump system with a capillary wick-based passive circulation system. The capillary wick structure utilizes surface tension forces to drive refrigerant circulation without mechanical moving parts, thereby eliminating the reliability issues associated with pump motion parts while maintaining effective heat dissipation capability.
Solution Approach 2:
The invention extracts and removes the pump component entirely from the liquid cooling system, replacing it with a passive capillary circulation mechanism. This extraction eliminates the complexity and cost associated with pump mechanisms and their required backup systems while preserving the essential refrigerant circulation function.
3Ease of operation
If quick connectors are used to connect heat dissipation pipelines, then ease of installation is improved, but reliability deteriorates due to refrigerant leakage risk under high pressure
Solution Approach 1:
The patent replaces the high-pressure pump-driven system with a low-pressure capillary circulation system. This pressure reduction eliminates the refrigerant leakage risk at quick connector interfaces while maintaining installation convenience, as the quick connectors operate in a safe low-pressure environment without requiring complex high-pressure sealing mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high heat transfer efficiency with stable reliability and no risk of refrigerant leakage, driven by capillary force, reducing the need for additional driving elements and maintaining negative pressure within the loop heat pipe.
Implementation Method 1
a capillary structure is provided inside the evaporation section, and the capillary structure provides a capillary suction force to enable the refrigerant to circulate in the loop heat pipe
Implementation Method 2
The heat exchanger dissipates heat from coolant in the coolant loop to refrigerant in the refrigerant loop
Implementation Method 3
the evaporation section is connected between the first steam pipe and the first liquid pipe
Data Source
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AI summary
The present invention discloses a heat-pipe heat dissipation system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section that is connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger that is connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe, so that the first pipeline and the second pipeline are joined to form a loop heat pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe. The present invention has advantages of high heat transfer efficiency, good reliability, and no risk of refrigerant leakage. The present invention further provides a power device.