Loop Heat Pipe Grooved Vapor and Liquid Pipes

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Solution Overview

Problem

The challenge in loop heat pipes is that when the pipes connecting the evaporator and condenser are bent, compressive and tensile stresses are generated, leading to potential blocking or closing of the pipes, which prevents the loop heat pipe from functioning properly.

Innovation Solution

A loop heat pipe design featuring a stacked structure with metal layers forming an evaporator, condenser, vapor pipe, and liquid pipe, where the vapor and liquid pipes have grooves on their outer surfaces extending linearly along their width direction to absorb deformation caused by bending, preventing pipe closure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the pipes connecting the evaporator and condenser are bent to adjust height position, then the loop heat pipe can be accommodated in electronic devices with different configurations, but compressive and tensile stresses are generated causing the pipes to be blocked or closed

Engineering Contradiction:
Improveadjustability of height positionVSAvoidpipe blockage prevention
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The pipe is designed with a grooved structure on its outer surface, creating a flexible-like behavior that allows bending without closure. The grooves enable the pipe wall to deform elastically during bending while maintaining the internal passage open, effectively allowing height adjustment without compromising reliability.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The outer surface of the pipe is segmented into multiple grooves that divide the continuous pipe wall into sections. This segmentation allows localized deformation in each groove region during bending, distributing the stress and preventing overall pipe closure while enabling the necessary height position adjustment.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If the pipe wall is made thinner to reduce manufacturing complexity, then the manufacturing process becomes easier, but the pipe becomes more susceptible to blocking when bent

Engineering Contradiction:
Improvepipe manufacturing simplicityVSAvoidpipe blockage resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The grooved structure on the pipe outer surface creates a flexible shell effect that compensates for thinner wall thickness. The grooves allow the pipe to bend without the thin wall collapsing, maintaining reliability while enabling simpler manufacturing with thinner, easier-to-form materials.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows the loop heat pipe to maintain a large cross-sectional flow passage area and prevent fluid resistance increases even when bent, ensuring effective heat transfer and preventing pipe blockage.

Implementation Method 1

an evaporator for absorbing the heat of a heat generating component, a vapor pipe for guiding the vapor generated in the evaporator toward the condenser

Methodology Applied
Scientific EffectVaporization: Evaporation

Implementation Method 2

a condenser for liquefying the vapor generated in the evaporator, a liquid pipe for guiding the liquid generated in the condenser toward the evaporator

Methodology Applied
Scientific EffectCondensation: Condensation

Data Source

PatentEP3505858B1Loop heat pipe, electronic device, and method of manufacturing loop heat pipe
Publication Date: 2020.02.26 SHINKO ELECTRIC IND CO LTD
  • EP3505858B1 patent drawingFigure 1A~1B
  • EP3505858B1 patent drawingFigure 2
  • EP3505858B1 patent drawingFigure 3A~3B

AI summary

A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.