Loop Heat Pipe With Partitioned Evaporator Channels

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Solution Overview

Problem

Current loop type heat pipes face difficulties in efficiently dissipating the increasing amount of heat generated by improved signal processing components, such as CPUs, due to limitations in heat transfer capacity.

Innovation Solution

The proposed loop type heat pipe design includes multiple evaporators, condensers, and pipes with partitioned flow channels and porous bodies to enhance heat dissipation, utilizing a dual condenser setup with separate vapor and liquid pipes to prevent backflow and improve heat transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If a single condenser is used in the loop type heat pipe, then the device structure is simple, but the heat dissipation capacity is insufficient for high-power electronic components

Engineering Contradiction:
Improveheat dissipation capacityVSAvoiddevice structure
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent divides the condensation function into two separate condensers (first condenser and second condenser) instead of using a single condenser. Each condenser has its own independent liquid pipe and vapor pipe, allowing the heat pipe to handle higher heat loads by distributing the condensation process across multiple units. This segmentation directly increases the heat dissipation capacity while managing the complexity through modular design.

Inventive Principle:
Principle #1Segmentation

2Power

If multiple flow channels are used to increase heat transfer capacity, then heat dissipation improves, but fluid flow stability and prevention of backflow becomes more difficult

Engineering Contradiction:
Improveheat transfer capacityVSAvoidfluid flow stability
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent segments the flow channels into distinct first and second flow channels, each connected to its own condenser. This segmentation allows independent control and optimization of fluid flow in each channel, improving stability while maintaining high heat transfer capacity through parallel flow paths.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces porous bodies as intermediary elements within the flow channels. These porous bodies act as flow regulators that stabilize the working fluid flow, prevent backflow between channels, and ensure reliable operation while allowing high heat transfer capacity through the distributed channel structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively increases the heat dissipation capacity, allowing for more efficient cooling of high-power electronic components by utilizing multiple condensers and partitioned flow channels to stabilize fluid flow and prevent dry-out states, thereby enhancing thermal management.

Implementation Method 1

The working fluid inside the liquid pipe is guided to the evaporator by capillary force generated in the porous body so that vapor is restrained from flowing backward from the evaporator into the liquid pipe

Methodology Applied
Scientific EffectCapillary force: Capillary Action

Implementation Method 2

an evaporator vaporizing working fluids

Methodology Applied
Scientific EffectPhase change (vaporization): Phase Change

Implementation Method 3

an evaporator that vaporizes working fluids

Methodology Applied
Scientific EffectHeat absorption: Evaporation

Implementation Method 4

a first condenser and a second condenser that liquefy the working fluids respectively

Methodology Applied
Scientific EffectPhase change (condensation): Condensation

Implementation Method 5

a first condenser and a second condenser that liquefy the working fluids respectively

Methodology Applied
Scientific EffectHeat release: Condensation

Data Source

PatentUS11828538B2Loop type heat pipe
Publication Date: 2023.11.28 SHINKO ELECTRIC IND CO LTD
  • US11828538B2 patent drawing
  • US11828538B2 patent drawing
  • US11828538B2 patent drawing

AI summary

A loop type heat pipe includes: an evaporator that vaporizes working fluids; a first condenser and a second condenser that liquefy the working fluids respectively; a first liquid pipe that includes a first flow channel and connects the evaporator and the first condenser to each other; a second liquid pipe that includes a second flow channel and connects the evaporator and the second condenser to each other; and a first vapor pipe that connects the evaporator and the first condenser to each other; and a second vapor pipe that connects the evaporator and the second condenser to each other. The evaporator includes: a third flow channel connected to the first liquid pipe and the first vapor pipe; a fourth flow channel connected to the second condenser and the second vapor pipe; and a partition wall that partitions the third flow channel and the fourth flow channel from each other.