Loop Heat Pipe Recess Layout for Better Heat Dissipation
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Solution Overview
Problem
Conventional loop heat pipes do not provide sufficient heat dissipation performance.
Innovation Solution
A loop heat pipe design that includes an evaporator, a condenser, a liquid pipe, and a vapor pipe, with a porous body inside these components, featuring recessed portions on specific areas of the main surfaces to enhance heat dissipation, and a manufacturing method that involves forming these recessed portions to ensure proper bonding and capillary action.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional loop heat pipe structure is used, then the device is simple and easy to manufacture, but the heat dissipation performance is insufficient
Solution Approach 1:
The patent applies local quality by forming recessed portions only in specific areas of the heat pipe components. The recessed portions are formed in first areas (located directly above or below the flow path) but not in second areas (located directly above or below pipe walls) or third areas (located directly above or below the porous body). This localized modification enhances heat dissipation performance in critical areas while maintaining structural integrity and ease of manufacture in other areas.
2Reliability
If recessed portions are formed in all areas of the heat pipe, then heat dissipation performance is enhanced, but manufacturing complexity and bonding reliability deteriorate
Solution Approach 1:
The patent selectively forms recessed portions only in first areas (located directly above or below the flow path) while excluding second areas (pipe wall areas) and third areas (porous body areas). This selective approach enhances heat dissipation where the flow path is located while avoiding complications in bonding and porous body formation that would occur if recesses were formed everywhere.
Solution Approach 2:
The patent performs the recessed portion formation as a preliminary step before forming the porous body and before bonding the heat pipe components. By preparing the recessed portions in advance in the first areas, the subsequent processes of porous body formation and bonding can proceed without interference, maintaining manufacturing simplicity while achieving enhanced heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation performance by preventing backflow and ensuring efficient vaporization and condensation of the working fluid, thereby improving thermal management in electronic devices.
Implementation Method 1
The working fluid in the liquid pipe is guided to the evaporator by a capillary force generated in the porous body to prevent vapor from reversely flowing from the evaporator to the liquid pipe
Implementation Method 2
an evaporator configured to vaporize a working fluid with the heat of a heat generating component
Implementation Method 3
a condenser configured to cool and condense the vaporized working fluid
Data Source
AI summary
A loop heat pipe includes: an evaporator; a condenser; a liquid pipe that connects the evaporator and the condenser; a vapor pipe that connects the evaporator and the condenser to form a loop flow path; and a porous body provided inside of a part of the evaporator, the condenser, the liquid pipe, and the vapor pipe. The evaporator, the condenser, the liquid pipe, and the vapor pipe have a first main surface. At least one recessed portion is formed in at least part of a first area, located directly above or below the flow path, of the first main surface, and is not formed in a second area, located directly above or directly below a pipe wall of the flow path, of the first main surface and is not formed in a third area, located directly above or below the porous body, of the first main surface.