Loop Thermosiphon Heat Sink for Dual GPU Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional loop thermosiphon (LTS) heat sinks require multiple units to dissipate heat from image processing units (GPUs), leading to increased space usage in electronic devices.
Innovation Solution
A single LTS heat sink design capable of dissipating heat from two GPUs simultaneously, utilizing a circulation passage with an evaporator, gas conduit, and liquid conduit, where the gas conduit is connected above the liquid conduit, and both are connected to the evaporator, allowing for efficient heat transfer and dissipation through a condenser with adjustable fin configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple LTS heat sinks are used for each GPU, then heat dissipation effectiveness is improved, but device space consumption increases
Solution Approach 1:
The patent combines multiple heat dissipation functions into a single LTS heat sink unit. The evaporator is designed with multiple heating surfaces that can simultaneously contact multiple heat generating components, allowing one heat sink to replace multiple traditional units while maintaining effective heat dissipation for each component
Solution Approach 2:
The LTS heat sink is designed as a multi-functional device where a single unit can dissipate heat from multiple different heat generating components simultaneously. The circulation passage system and evaporator structure are configured to handle thermal loads from multiple sources, making the device universally applicable to various component arrangements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the required mounting space for heat sinks in electronic devices by effectively dissipating heat from multiple GPUs using a single unit, enhancing thermal management without increasing the physical footprint.
Implementation Method 1
an evaporator, a condenser, a gas conduit, and a liquid conduit. The gas conduit is located above the liquid conduit. One end of the gas conduit is connected to one end of the liquid conduit, and another end of the gas conduit and another end of the liquid conduit are connected to the evaporator
Implementation Method 2
heat generated by the components is transmitted to the evaporator, and a cooling medium received in a circulation passage formed by a condenser, the gas conduit, and the liquid conduit is evaporated into a gas
Data Source
AI summary
A loop thermosiphon (LTS) heat sink includes an evaporator, a condenser, a gas conduit, and a liquid conduit. The evaporator includes a first surface, a second surface opposite to the first surface, and a third surface coupled between the first surface and the second surface. Each of the first surface and the second surface is configured to mount a heat generating component. One end of the gas conduit is coupled to one end of the liquid conduit, and another end of the gas conduit and another end of the liquid conduit are coupled to the evaporator through the third surface. The evaporator, the gas conduit, and the liquid conduit cooperatively form a circulation passage. A connecting portion of the gas conduit and the liquid conduit is received within the condenser.