Loop-Type Heat Pipe With Segmented Evaporator and Porous Flow Control
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Solution Overview
Problem
The increasing heat generation in heat components, such as CPUs, poses challenges for sufficient heat radiation in traditional loop-type heat pipes, making it difficult to effectively cool these components.
Innovation Solution
A loop-type heat pipe design featuring multiple condensers and vapor/liquid pipes with porous bodies to enhance heat dissipation, where the evaporator is connected to multiple condensers through separate vapor and liquid pipes, and a connecting portion with a porous body to guide the operating fluid and prevent vapor backflow, utilizing high heat conductivity metal layers for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a traditional loop-type heat pipe with a single evaporator and condenser is used, then the structure is simple, but the heat radiation capability is insufficient for high heat generation components
Solution Approach 1:
The heat pipe system is segmented into multiple independent flow paths, each consisting of an evaporator section, condenser section, liquid pipe, and vapor pipe. This segmentation allows parallel heat transfer channels to handle higher total heat loads while maintaining manageable individual path complexity
Solution Approach 2:
Multiple flow paths are merged at the evaporator through a connecting portion with porous bodies that integrate liquid supply from multiple paths. The condensers are also positioned to collectively radiate heat to the same external region, combining their cooling effects
2Power
If the operating fluid flows rapidly through the heat pipe to handle high heat loads, then heat radiation improves, but vapor backflow from condenser to evaporator increases
Solution Approach 1:
Porous bodies are strategically placed at the connecting portion and within the liquid pipe to utilize capillary forces. These porous structures allow liquid to be drawn forward by capillary action while the narrow pore structures resist vapor backflow, creating a one-way flow control mechanism
Solution Approach 2:
Different sections of the heat pipe have different structural qualities optimized for their specific functions: the evaporator has high porosity for fluid distribution, the connecting portion has controlled porosity for flow direction control, and the condenser has dense structure for efficient condensation
3Reliability
If porous bodies are added to control fluid flow and prevent backflow, then vapor backflow is suppressed, but the device complexity increases
Solution Approach 1:
The porous bodies perform multiple functions simultaneously: they distribute liquid evenly across the evaporator surface, provide capillary forces to drive liquid flow, and act as check valves to prevent vapor backflow. This multi-functionality reduces the need for separate components for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for increased heat radiation to the outside, effectively managing heat generated in heat components by enhancing the flow paths and using capillary forces to prevent vapor backflow, thereby improving cooling efficiency and preventing dryout.
Implementation Method 1
the operating fluid in the liquid pipe is guided to the evaporator with a capillary force generated in the porous bodies and the vapor is suppressed from flowing from the evaporator back to the liquid pipe
Implementation Method 2
an evaporator configured to vaporize an operating fluid by heat of a heat generation component
Implementation Method 3
a condenser configured to cool and condense the vaporized operating fluid
Implementation Method 4
utilizing high heat conductivity metal layers for efficient heat transfer
Data Source
Figure 1
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AI summary
A loop-type heat pipe includes an evaporator (10), a first condenser (21), a second condenser (22), a first liquid pipe (41) having a first flow path (81) and configured to connect the evaporator (10) and the first condenser (21), a second liquid pipe (42) having a second flow path (82) and configured to connect the evaporator (10) and the second condenser (22), a first vapor pipe (31) configured to connect the evaporator (10) and the first condenser (21), a second vapor pipe (32) configured to connect the evaporator (10) and the second condenser (22), and a connecting portion (43) having a first porous body (310) and configured to connect the first liquid pipe (41) and second liquid pipe (42) to the evaporator (10). The evaporator (10) has a third flow path (83) connected to the first liquid pipe (41) and the first vapor pipe (31), a fourth flow path (84) connected to the second liquid pipe (42) and the second vapor pipe (32), and a partitioning wall (82) configured to partition the third flow path (83) and the fourth flow path (84).