Loop-Type Vapor Chamber for Multi-Element Cooling
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Solution Overview
Problem
Conventional heat-dissipating modules are inefficient in cooling multiple electronic elements due to long paths for condensed working liquid, leading to insufficient heat removal and increased space occupancy.
Innovation Solution
A loop-type vapor chamber heat-dissipating module with a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium, featuring a wick structure and supporting structure, which is tightly connected to the heat-dissipating body via high-heat-conductivity glue or solder, allowing for efficient heat transfer and reduced volume, and includes fixing plates for multiple electronic elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a conventional loop heat pipe is used with a long path for condensed working liquid, then the heat-dissipating module can be simpler in structure, but the working liquid temperature becomes too high to cool electronic elements effectively
Solution Approach 1:
The loop heat pipe is segmented into multiple U-shaped sections arranged in parallel, each handling a portion of the heat dissipation task. This segmentation shortens the path for condensed working liquid in each section while maintaining overall heat dissipation capacity, preventing the working liquid from overheating before returning to the evaporation section.
Solution Approach 2:
The heat pipe transitions from a conventional linear loop structure to a multi-dimensional arrangement with multiple U-shaped sections extending in different directions from a central condensation chamber. This dimensional expansion allows multiple heat dissipation paths simultaneously, reducing the effective path length for working liquid circulation.
2Reliability
If multiple heat-dissipating modules are provided for multiple electronic elements, then each element can be cooled effectively, but the space occupied by heat-dissipating modules increases
Solution Approach 1:
The heat-dissipating module is designed with multiple heat dissipation sections that can simultaneously cool multiple electronic elements. The vaporization section can contact multiple heat sources while the condensation chamber collects heat from all sections, allowing one module to perform the function of multiple conventional modules, thus reducing overall space occupancy.
Solution Approach 2:
Multiple heat dissipation pathways and condensation channels are merged into a single integrated module structure. The central condensation chamber serves as a common heat collection point for multiple U-shaped heat dissipation sections, combining the functionality of multiple independent heat pipes into one compact unit that coles multiple electronic elements simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency by maintaining low temperatures of the working fluid, enabling effective heat absorption from multiple electronic elements while minimizing space, thus improving the overall heat-dissipating performance.
Implementation Method 1
the wick structure is arranged on inner wall surfaces of the cover plate and the bottom plate
Implementation Method 2
a portion of the working liquid in the wick structure absorbs the heat generated by the electronic element and evaporates to become vapor
Implementation Method 3
The heat generated by the electronic element is conducted to a portion of the wick structure in the evaporating portion
Implementation Method 4
The vapor-phase working liquid flows to the condensing portion of the loop heat pipe and releases its latent heat to the heat-dissipating body
Implementation Method 5
releases its latent heat to the heat-dissipating body
Implementation Method 6
the vapor-phase working fluid condenses to flow from the condensing portion back to the evaporating portion via the capillary force generated in the wick structure
Implementation Method 7
the heat absorbed by the portion of the wick structure in the condensing portion is dissipated to the outside via the heat-dissipating body
Data Source
AI summary
A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.