Loopback Circuit Package With Recessed Capacitors for Low Signal Loss
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Solution Overview
Problem
Conventional loopback circuits using passive components like inductors and capacitors suffer from signal loss of high-frequency signals and increased overall thickness, which are problematic in high-performance integrated circuits.
Innovation Solution
A loopback circuit package design featuring inductors and capacitors with trench structures and dummy pads to minimize signal loss and thickness, utilizing a semiconductor substrate with recesses and a package substrate to enhance signal transmission and shock mitigation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional passive components (inductors and capacitors) are used in loopback circuits, then the circuit can be manufactured with standard processes, but signal loss of high-frequency signals occurs and overall thickness increases
Solution Approach 1:
The patent transitions capacitor placement from a planar arrangement to a three-dimensional configuration by forming recesses in the semiconductor substrate and placing capacitors within these recesses. This vertical integration reduces the overall thickness of the loopback circuit while maintaining electrical performance and reducing signal loss.
Solution Approach 2:
The patent embeds capacitors within recesses formed in the semiconductor substrate, creating a nested structure where the capacitor is housed inside the substrate volume rather than occupying additional planar space. This nesting approach reduces overall circuit thickness while maintaining component functionality.
2Adaptability or versatility
If inductors and capacitors are integrated into the loopback circuit, then the circuit functionality is achieved, but the overall thickness of the package increases
Solution Approach 1:
The patent utilizes vertical space by forming recesses in the semiconductor substrate and placing capacitors within these recesses. This three-dimensional integration allows full circuit functionality to be achieved while reducing the overall package thickness compared to planar integration approaches.
Solution Approach 2:
The patent merges the capacitor structure with the semiconductor substrate by forming recesses directly in the substrate and integrating capacitors within these recesses. This consolidation eliminates the need for separate capacitor mounting layers, reducing overall package thickness while maintaining functionality.
3Ease of operation
If signal transmission paths are extended to connect components, then circuit connectivity is achieved, but signal loss of high-frequency signals increases
Solution Approach 1:
The patent reduces signal transmission path length by placing capacitors vertically within recesses in the semiconductor substrate, closer to the inductors. This three-dimensional arrangement shortens the electrical connection paths compared to planar layouts, reducing signal loss for high-frequency signals while maintaining full connectivity.
Data Source
AI summary
A loopback circuit package comprises an inductor layer and a semiconductor substrate. The inductor layer includes a first inductor, a second inductor, a third inductor, and a fourth inductor, and. The semiconductor substrate includes a first capacitor electrically connected to the first inductor and the second inductor, and a second capacitor electrically connected to the third inductor and the fourth inductor. The first capacitor and the second capacitor are disposed in a first recess and a second recess of the semiconductor substrate, respectively.