Looped Electrode Swaging for Semiconductor Miniaturization
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Solution Overview
Problem
Existing semiconductor devices face challenges in miniaturization due to complex manufacturing processes and misalignment issues caused by the need for electrode bending, which increases the exposed metal area and obstructs product miniaturization, especially in high-reliability applications like electric railroads and automotive devices.
Innovation Solution
A semiconductor device design featuring a semiconductor chip with a looped electrode and a cylindrical electrode with a screw thread, where the narrow portion of the cylindrical electrode is inserted into the looped portion, and the connection is secured using a wide portion formed by swaging, allowing for a simpler manufacturing process and reduced external metal exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrode is bent outside the case to connect to the nut, then the connection between the control driver and semiconductor device is secured, but the manufacturing complexity increases and misalignment failures occur
Solution Approach 1:
Instead of bending the electrode outside the case to reach the nut, the invention inverts the approach by forming the nut inside the case and having the electrode connect to it internally. The electrode is bent within the case cavity to connect to the nut, eliminating the need for external bending operations and reducing manufacturing complexity while maintaining connection reliability.
Solution Approach 2:
The invention moves the connection point from the external dimension to the internal dimension of the case. By positioning the nut inside the case and having the electrode connect internally, the design transitions from an external connection architecture to an internal one, simplifying the manufacturing process and eliminating misalignment issues associated with external bending.
2Reliability
If the electrode is bent outside the device, then the connection to the nut is achieved, but the exposed metal area increases and miniaturization is obstructed
Solution Approach 1:
The invention extracts the nut from the external environment and places it inside the case. By moving the connection point internally and eliminating the external bent electrode portion, the exposed metal area is significantly reduced, enabling product miniaturization while maintaining reliable electrical connection through the internal electrode-nut interface.
3Strength
If a screw and nut connection is used for high-reliability applications, then the connection strength is ensured, but the manufacturing process becomes more complex compared to press-fit structures
Solution Approach 1:
The nut is pre-formed inside the case during the case manufacturing process itself, rather than being added as a separate component. This preliminary integration of the nut into the case structure eliminates the need for separate assembly steps and complex manufacturing processes, while still providing the strong mechanical connection of a screw-nut system.
Solution Approach 2:
The invention merges the nut with the case structure, creating an integrated component rather than separate parts. By forming the nut as an integral part of the case during molding or manufacturing, the design combines two previously separate elements (case and nut) into one, simplifying the manufacturing process while maintaining the strength benefits of threaded connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables miniaturization of semiconductor devices by eliminating the need for electrode bending, simplifying the manufacturing process, and improving the insulating distance, while maintaining high reliability and efficiency.
Implementation Method 1
a mold clamping of clamping an upper mold half and the lower mold half together to compress with the upper mold half a portion of the narrow portion which protrudes from the looped portion upward, thus forming a wide portion spreading over the looped portion
Data Source
AI summary
A semiconductor device includes a semiconductor chip, an electrode electrically connected to the semiconductor chip, the electrode including a looped portion, a cylindrical electrode including a main portion having a screw thread formed therein and a narrow portion continuous with the main portion, the narrow portion having a smaller width than the main portion, the cylindrical electrode being electrically connected to the electrode by the narrow portion being inserted into the looped portion, and a case for the semiconductor chip and the electrode, the case contacting the main portion while causing the screw thread and a connecting portion between the looped portion and the cylindrical electrode to be exposed.