Dual Looped Frame Cooling Assembly for Sealed Hyperbaric Airflow

Solution Overview

Problem

Conventional hyperbaric flow architectures in electronic devices face issues such as leakage and improper partitioning due to factors like cable interference, sponge deformation, and improper attachment, leading to compromised thermal performance and manufacturing challenges.

Innovation Solution

The use of dual looped frames with gaskets and cover sheets to create a hyperbaric chamber that maintains positive pressure, ensuring effective cooling and structural integrity, while minimizing deformation and assembly errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional hyperbaric flow architecture is used with partitions and sponges, then cooling performance can be achieved, but leakage and improper partitioning occur due to cable interference, sponge deformation, and improper attachment

Engineering Contradiction:

Improveskin temperatureVSAvoidseal integrity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The device is divided into separate hyperbaric and evacuative chambers with distinct fan systems. The hyperbaric chamber uses a first fan to force air through heat exchangers, while the evacuative chamber uses a second fan to draw air through heat exchangers. This segmentation eliminates the need for complex partitions and sponges that caused leakage, while maintaining effective cooling through independent chamber operations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent inverts the conventional single-chamber hyperbaric approach by implementing dual independent chambers with opposite pressure regimes. Instead of using one chamber to force air through the entire device, the invention uses one chamber to force air and another to draw air, creating balanced pressure zones that eliminate seal stress and deformation issues.

Inventive Principle:

Principle #13The other way round (Inversion)

2Stress or pressure

If partitions and sponges are used to create hyperbaric chambers, then positive pressure can be maintained, but manufacturing complexity increases due to improper attachment and assembly issues

Engineering Contradiction:

Improvepositive pressureVSAvoidassembly process

Core Design Contradiction:

Stress or pressureVSEase of manufacture

Solution Approach 1:

The device is divided into separate hyperbaric and evacuative chambers with distinct fan systems. The hyperbaric chamber uses a first fan to force air through heat exchangers, while the evacuative chamber uses a second fan to draw air through heat exchangers. This segmentation eliminates the need for complex partitions and sponges that caused leakage, while maintaining effective cooling through independent chamber operations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent inverts the conventional single-chamber hyperbaric approach by implementing dual independent chambers with opposite pressure regimes. Instead of using one chamber to force air through the entire device, the invention uses one chamber to force air and another to draw air, creating balanced pressure zones that eliminate seal stress and deformation issues.

Inventive Principle:

Principle #13The other way round (Inversion)

3Device complexity

If single fan hyperbaric architecture is used, then device complexity is reduced, but thermal performance is compromised

Engineering Contradiction:

Improvefan system complexityVSAvoidcooling performance

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The device is divided into separate hyperbaric and evacuative chambers with distinct fan systems. The hyperbaric chamber uses a first fan to force air through heat exchangers, while the evacuative chamber uses a second fan to draw air through heat exchangers. This segmentation eliminates the need for complex partitions and sponges that caused leakage, while maintaining effective cooling through independent chamber operations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent inverts the conventional single-chamber hyperbaric approach by implementing dual independent chambers with opposite pressure regimes. Instead of using one chamber to force air through the entire device, the invention uses one chamber to force air and another to draw air, creating balanced pressure zones that eliminate seal stress and deformation issues.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances thermal performance with lower fan noise, improved skin temperature, and reduced manufacturing costs by maintaining seal integrity and eliminating assembly issues.

Implementation Method 1

a first fan to force air into a space between the first looped frame and the second looped frame to create a positive pressure in the space

Methodology Applied

Scientific EffectPositive pressure: Pressure Increase

Implementation Method 2

a thermal module between the first looped frame and the second looped frame

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

air to flow around a top side and a bottom side of the thermal module to cool the electronic components

Methodology Applied

Scientific EffectConvection cooling: Convection

Data Source

PatentUS12581611B2Methods and apparatus to cool electronic devices

Publication Date: 2026.03.17 INTEL CORP

AI summary

Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis including a first cover and a second cover. The example electronic device also includes a first looped frame spaced apart from the first cover, a second looped frame spaced apart from the second cover, and a printed circuit board between the first looped frame and the second looped frame.