Looped Heat Sink Elements for Liquid Cooling Systems
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid cooling systems for electronic components, particularly in high-power applications, face challenges in achieving efficient thermal management while maintaining low production and operating costs, with complex and costly solutions like metal labyrinths or strip patterns often falling short in ensuring consistent heat removal across varying conditions.
Innovation Solution
A liquid cooling system featuring a nickel-plated copper exchanger plate with heat sink elements shaped as loops that extend parallel to the flow direction, creating increased turbulence and a greater heat exchange surface through a geometric arrangement that enhances heat removal efficiency without significant hydraulic resistance or production complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal labyrinth or pattern of metal elements is used to increase thermal exchange surface, then heat exchange efficiency is improved, but production cost and manufacturing complexity increase significantly
Solution Approach 1:
The invention changes the geometric parameters of the cooling fins from complex three-dimensional labyrinth structures to simple planar patterns with optimized dimensions. The fins are arranged in parallel with specific spacing and length parameters that can be easily controlled during standard manufacturing processes, achieving effective heat exchange without complex machining or tooling
Solution Approach 2:
The invention replaces expensive, complex metal labyrinth structures with simple, inexpensive planar fin patterns that can be manufactured using cost-effective processes such as stamping, extrusion, or additive manufacturing. The simplified geometry reduces material waste and manufacturing time while maintaining adequate cooling performance
2Temperature
If the flow rate of cooling fluid is increased to improve thermal power removal, then heat exchange efficiency is improved, but the size of recirculating pumps and system complexity increase
Solution Approach 1:
The cooling fin structure is designed to maximize natural convection and passive heat dissipation through its geometry. The parallel arrangement and spacing of fins create optimized fluid flow paths that enhance heat transfer without requiring high flow rates, allowing the system to operate effectively with smaller, simpler recirculating pumps
3Temperature
If complex metal labyrinth structures are used to increase heat exchange surface area, then cooling efficiency is improved, but hydraulic resistance increases
Solution Approach 1:
The heat exchange surface is segmented into multiple parallel fin structures rather than a single complex labyrinth. This segmentation creates multiple independent flow channels that reduce hydraulic resistance while collectively providing sufficient heat exchange surface area. The fluid can flow through multiple parallel paths simultaneously, reducing pressure drops
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved heat exchange efficiency and reduced production costs by increasing turbulence and heat exchange surface density, effectively managing high-power electronic component temperatures while minimizing hydraulic resistance and production complexity.
Implementation Method 1
a tank (36) delimited at least partially by said second exchanger plate wall and suitable to be crossed by a flow of cooling liquid
Implementation Method 2
Said metal elements transmit the heat of the exchanger plate by conduction in correspondence of its anchor points (by welding) to the plate itself
Implementation Method 3
heat sink elements shaped as loops that extend parallel to the flow direction, creating increased turbulence and a greater heat exchange surface
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A liquid cooling system (4) for an electronic component (8), comprising an exchanger plate (24) having a first wall (28) suitable to be at least partially interfaced to an electronic component (8) to be cooled and a second wall (32), placed in contact with a cooling liquid, a plurality of heat sink elements (40), associated to said second wall (32) and influenced by the cooling fluid so as to dissipate heat, wherein the heat sink elements (40) are shaped according to regular patterns (44) that extend parallel to a main extension direction (X-X) and that comprise a plurality of loops (48), wherein each loop (48) comprises a continuous curvilinear section (52) that extends cantilevered from a first to a second attachment end (56, 60) fixed to the second wall (32). Advantageously, the continuous curvilinear section (52) is shaped so that, a first and a second plane (P1, P2) being traced perpendicular to the second wall (32) passing respectively through said first and second ends (56, 60), the continuous curvilinear section (52) extends at least partially outside the space (S) defined between said perpendicular planes (P1, P2).