Lorentz Force MEMS Electronic Compass for Multi-Axis Sensing
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Solution Overview
Problem
Conventional MEMS technologies face challenges in creating sensitive structures to measure magnetic fields effectively for applications like electronic compassing, and existing MEMS structures are not well-suited for implementation across multiple axes.
Innovation Solution
An integrated electronic compass system is developed, incorporating a semiconductor substrate with CMOS integrated circuits and MEMS devices such as accelerometers and magnetic sensors, utilizing a Lorentz force configuration to measure magnetic fields, with movable structures and capacitance sensing to enhance displacement detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional MEMS structures are used for magnetic field sensing, then device compatibility is maintained, but measurement precision and sensitivity are insufficient
Solution Approach 1:
The magnetic field sensing function is segmented into multiple independent sensing elements arranged in specific geometric patterns. Each element responds to different components of the magnetic field, and their combined output provides precise multi-axis measurement while maintaining compatibility with standard MEMS fabrication processes
Solution Approach 2:
The patent employs Lorentz force-based sensing mechanisms where current-carrying conductors experience force proportional to the magnetic field strength. By changing the electrical parameters (current direction and magnitude) and measuring the resulting mechanical displacement, the system achieves high sensitivity without requiring complex magnetic materials or structures
2Adaptability or versatility
If single-axis magnetic sensing is implemented, then device complexity is reduced, but adaptability for multi-axis applications is limited
Solution Approach 1:
The MEMS device is designed with universal sensing elements that can detect magnetic field components along multiple axes. The same basic sensor structure and fabrication process can sense fields in different directions by simply changing the orientation of current flow and the arrangement of sensing elements, enabling multi-axis capability without proportionally increasing device complexity
Solution Approach 2:
The patent transitions from single-axis to multi-axis sensing by adding spatial dimensions to the sensing architecture. Multiple sensing elements are arranged in three-dimensional configurations, allowing the system to capture magnetic field vectors in multiple directions simultaneously through geometric arrangement rather than complex individual sensor design
3Productivity
If integrated CMOS and MEMS systems are used, then productivity and integration are improved, but parasitic resistances increase
Solution Approach 1:
The patent replaces electrical resistance-based sensing with Lorentz force-based mechanical sensing. Instead of measuring small voltage changes across resistive elements (which are susceptible to parasitic resistance), the system uses current-carrying conductors that experience mechanical force in magnetic fields, with displacement detected by capacitive or optical means. This substitution eliminates the impact of parasitic resistances on measurement accuracy while maintaining compatibility with integrated CMOS-MEMS fabrication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high accuracy and sensitivity in measuring magnetic fields, enabling effective electronic compassing across multiple axes without requiring substantial modifications to conventional equipment or processes, and offers higher device yields and reduced parasitic resistances.
Implementation Method 1
utilizing a Lorentz force configuration to measure magnetic fields
Implementation Method 2
with movable structures and capacitance sensing to enhance displacement detection
Data Source
AI summary
Embodiments of the present invention can provide an integrated electronic compass and circuit system having a semiconductor substrate and one or more CMOS integrated circuits formed on one or more portions of the semiconductor substrate. The system can have an electronic compass device operably coupled to the one or more CMOS integrated circuits. The system can also have a plurality of electronic compass devices configured in a parallel arrangement in a hub and spoke configuration.