Lost Core Electronic Enclosures for Seamless Undercut Molding
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Solution Overview
Problem
Conventional electronic enclosures are typically assembled from multiple parts, leading to parting lines and increased costs, while existing injection molding processes cannot easily produce enclosures with undercuts, limiting design flexibility and structural integrity.
Innovation Solution
The use of lost core injection molding to create seamless single unitary molded structures with undercuts, allowing for the integration of electronic assemblies with extended features without parting lines, enhancing structural strength and aesthetic appeal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional injection molding processes are used to create electronic enclosures, then the molding process is simple and straightforward, but the enclosures cannot include undercut features and must be assembled from multiple parts
Solution Approach 1:
A lost core (intermediary object) is introduced into the molding cavity to enable the formation of undercut features. The core is temporarily present during molding, allows the plastic to form around it creating the desired undercut geometry, and is subsequently removed through dissolution or melting, leaving the final part with the complex undercut feature that would otherwise be impossible to mold
Solution Approach 2:
The physical state of the core material is changed during the process - it starts as a solid form, allows molding to occur, then undergoes phase change (dissolution or melting) to be removed. This parameter change enables the core to serve its function temporarily and then be eliminated, allowing undercut features to be formed
2Shape
If multiple parts are assembled to create an electronic enclosure with undercut cavity, then the undercut geometry can be achieved, but parting lines are formed and manufacturing cost increases
Solution Approach 1:
Multiple separate molded parts are merged into a single unitary structure by using a lost core to enable the molding of an undercut cavity in one piece. The core allows the plastic to form a complete enclosed cavity with undercut features that would otherwise require assembly of multiple parts, eliminating parting lines and reducing manufacturing steps
3Shape
If multiple parts are used to assemble an electronic enclosure, then undercut features can be formed, but structural strength is reduced due to parting lines and joints
Solution Approach 1:
Separate parts are merged into a single monolithic structure through the lost core molding process. The plastic material forms a continuous structure without joints or parting lines, eliminating weak points where cracks could propagate. The resulting unitary structure has superior structural integrity while maintaining the desired undercut geometry
Data Source
AI summary
An electronic product includes an electronic enclosure having a housing pocket fabricated as a seamless single unitary molded structure. The single unitary molded structure defines a cavity therein and has at least one molded undercut feature extending over a portion of the cavity. The housing pocket includes a side opening that is sufficiently large to allow lateral insertion of the electronic assembly into position in the cavity with at least a portion of the electronic assembly extending underneath the at least one molded undercut feature.