Low-Boiling Conductive Ink for Fast Drying Uniform Films
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Solution Overview
Problem
Existing conductive inks using high-boiling-point solvents like N, N-dimethylformamide (DMF) and dimethyl sulfoxide (DMSO) result in slow evaporation rates and low production efficiency due to their high boiling points and low saturated vapor pressures, which are not suitable for roll-to-roll manufacturing processes.
Innovation Solution
A conductive ink comprising 1% to 85% organic conductive material and 15% to 99% solvent with a boiling point of 150°C or less, allowing for rapid solvent evaporation and easy film formation, enhancing production efficiency and film uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If high-boiling-point solvents like DMF and DMSO are used to dissolve organic conductive materials, then the organic conductive materials can be effectively dissolved, but the evaporation rate becomes slow and drying time increases significantly
Solution Approach 1:
The patent changes the key parameter of solvent boiling point from high (DMF: 153°C, DMSO: 189°C) to low (≤150°C, preferably ≤120°C). This parameter change enables the solvent to maintain good dissolution capability for organic conductive materials while achieving rapid evaporation and short drying times, directly resolving the contradiction between dissolution capability and evaporation rate
Solution Approach 2:
The patent employs low-boiling-point solvents that evaporate completely and rapidly after coating, leaving no residual solvent in the final conductive film. This approach is analogous to using disposable objects that serve their purpose and then disappear, ensuring the solvent fulfills its dissolution function during processing but does not remain to affect final product performance
2Stability of the object's composition
If high-boiling-point solvents are used, then the organic conductive materials can be dissolved, but the drying time becomes excessively long requiring overnight operations
Solution Approach 1:
By changing the solvent's boiling point parameter to ≤150°C (preferably ≤120°C), the patent achieves rapid evaporation that reduces drying time from overnight (12+ hours) to minutes or short periods, directly addressing the time loss issue while preserving dissolution capability
Solution Approach 2:
The patent uses low-boiling-point solvents that rush through the evaporation process quickly, completing the drying step in minimal time rather than requiring prolonged overnight drying. This allows the manufacturing process to move rapidly from coating to finished product
3Productivity
If low-boiling-point solvents are used, then rapid evaporation and high production efficiency are achieved, but the film formation quality must be maintained
Solution Approach 1:
The patent optimizes the solvent boiling point parameter to a specific range (≤150°C, preferably ≤120°C) that balances rapid evaporation with sufficient time for uniform film formation. This precise parameter control ensures both high production efficiency and excellent film quality with uniform thickness and flat surface
Solution Approach 2:
The low-boiling-point solvent provides sufficient time during its evaporation process for the organic conductive material to self-organize and form a uniform film structure before complete drying occurs. This preliminary film formation action ensures manufacturing precision is maintained while achieving rapid overall processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive ink with a low-boiling-point solvent facilitates rapid solvent evaporation, resulting in uniform, flat, and dense conductive films with excellent conductivity, suitable for mass production and flexible applications.
Implementation Method 1
the solvents need to be evaporated during the film formation process. However, the solvents exhibit high boiling points and low saturated vapor pressures at room temperature, which lead to slow evaporation and long drying times
Data Source
AI summary
A conductive ink, a preparation method and application thereof are provided and relate to the field of conductive ink technology. The conductive ink includes the following components in weight percentage, based on a total weight of the conductive ink being 100%: 1% to 85% of an organic conductive material, and 15% to 99% of a solvent. The solvent has a boiling point lower than or equal to 150° C. The conductive ink provided in the present application includes the organic conductive material and the solvent. Since the solvent having a boiling point lower than or equal to 150° C., the conductive ink of the present application not only dries quickly during coating and has high production efficiency, but also forms a transparent conductive film layer that is uniform, flat, and dense, and has good product quality.