Low-Dielectric Adhesive Composition Balancing Adhesion and CTE
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Solution Overview
Problem
Existing adhesive compositions for electronic parts, particularly those used in flexible printed circuit boards, face challenges in achieving high adhesiveness and low dielectric properties, as well as a small linear thermal expansion coefficient (CTE), which are necessary for high-frequency applications like 5G communication.
Innovation Solution
A resin composition containing a maleimide resin with a molecular weight of 1,000 or more, combined with a benzoxazine resin and an alkenyl resin in specific ratios, to form a low-dielectric adhesive layer with improved adhesiveness and a small CTE.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a high molecular weight maleimide resin is used to improve adhesiveness, then adhesiveness is improved, but the linear thermal expansion coefficient (CTE) becomes large
Solution Approach 1:
The patent changes the molecular weight parameter of the maleimide resin from low to high (1,000 or more) to improve adhesiveness. It also optimizes the mixing ratio parameters of benzoxazine resin and alkenyl resin to control the CTE of the adhesive layer, thereby resolving the contradiction between adhesiveness and thermal expansion.
Solution Approach 2:
The patent creates a composite resin system combining maleimide resin, benzoxazine resin, and alkenyl resin. This composite material approach allows the high molecular weight maleimide resin to provide adhesiveness while the benzoxazine and alkenyl resins help control the overall CTE of the adhesive layer.
2Reliability
If low-dielectric adhesives are used to reduce dielectric constant for high frequency applications, then dielectric properties are improved, but adhesiveness deteriorates
Solution Approach 1:
The patent uses maleimide resin with molecular weight of 1,000 or more, which provides both low dielectric constant suitable for high-frequency applications and high adhesiveness. The specific molecular weight parameter change enables simultaneous achievement of both dielectric properties and adhesiveness.
Solution Approach 2:
The composite resin system combining maleimide resin, benzoxazine resin, and alkenyl resin achieves both low dielectric constant and high adhesiveness. The synergistic effect of the composite materials allows simultaneous optimization of dielectric properties and bonding strength.
3Strength
If a large CTE adhesive layer is formed to improve adhesiveness, then adhesiveness is improved, but warpage is caused and processability is degraded
Solution Approach 1:
The patent optimizes the mixing ratio of benzoxazine resin and alkenyl resin to control the CTE parameter of the adhesive layer. By adjusting these ratio parameters, the adhesive layer achieves both high adhesiveness and small CTE, preventing warpage and maintaining dimensional stability.
Solution Approach 2:
The patent applies different resin components with different properties to different functional requirements: maleimide resin for adhesiveness, benzoxazine and alkenyl resins for CTE control. This local quality approach ensures each component contributes to its specific function while maintaining overall performance.
Data Source
AI summary
The present invention provides a resin composition for forming a low-dielectric adhesive layer that has 5G compatible good electrical properties (low-dielectric properties), ensures high adhesiveness, and also has a small linear thermal expansion coefficient (CTE), and an adhesive composition containing the resin composition. The adhesive composition contains a maleimide resin (A) having a molecular weight of 1,000 or more, a benzoxazine resin (B), and an alkenyl resin (C) having a 1-alkenyl group, and a mixing ratio between the benzoxazine resin (B) and the alkenyl resin (C) in the resin composition is 1:10 to 10:1.