Low Dielectric Adhesive Composition for Multilayer Wiring Boards
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Solution Overview
Problem
Existing adhesiveness-imparting agents and interlayer adhesives for wiring circuit boards lack excellent heat resistance, affinity for thermosetting resins, and low dielectric properties, necessitating improvements in adhesiveness and compatibility with these materials.
Innovation Solution
A low dielectric resin composition comprising a polyolefin-based resin with a specific ratio of styrene-based elastomer and cyclic olefin-based polymer, which includes alicyclic rings in the main chain, providing enhanced adhesiveness, low dielectric properties, and heat resistance, along with improved affinity for thermosetting resins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If maleic anhydride graft-modified resins are used as adhesiveness-imparting agents, then adhesiveness is improved, but heat resistance deteriorates
Solution Approach 1:
The invention uses a composite resin composition containing both polyolefin resin (for heat resistance) and maleic anhydride graft-modified resin (for adhesiveness). This composite approach allows the material to simultaneously achieve high heat resistance (comparable to polyolefin) and excellent adhesiveness (comparable to graft-modified resins), resolving the contradiction between these two properties.
2Strength
If adhesiveness-imparting agent is added to resin layer, then adhesiveness to conductive layer is improved, but affinity for thermosetting resin deteriorates
Solution Approach 1:
The invention carefully controls the content ratio of the maleic anhydride graft-modified resin to be 5-50 parts by mass per 100 parts by mass of polyolefin resin. This parameter optimization ensures sufficient adhesiveness to the conductive layer while maintaining good affinity and compatibility with the thermosetting resin, preventing phase separation and保持良好的 overall composition stability.
3Strength
If interlayer adhesive is used to bond resin layer and conductive layer, then bonding is improved, but dielectric constant increases
Solution Approach 1:
The invention makes the polyolefin-based resin composition serve multiple functions simultaneously: it acts as both the base resin providing low dielectric constant and as the adhesiveness-imparting agent providing bonding strength. The maleic anhydride graft-modified resin component provides both adhesiveness and maintains low dielectric properties. This multi-functionality eliminates the need for separate high-dielectric-constant adhesive layers.
Data Source
Figure 1~2
Figure 3~4
Figure 5A~5C
AI summary
Alow dielectric resin composition includes a polyolefin-based resin. The polyolefin-based resin includes a styrene-based elastomer (A) and a cyclic olefin-based polymer (B) having an alicyclic ring in a main chain. A content ratio of the styrene-based elastomer (A) is 30 parts by mass or more and 89 parts by mass or less with respect to 100 parts by mass of the total amount of the styrene-based elastomer (A) and the cyclic olefin-based polymer (B).