Low Dielectric Insulating Material for High-Frequency PCBs
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Solution Overview
Problem
Conventional insulating resin materials for printed circuit boards have high dielectric constants and dissipation factors, leading to signal delay and loss in high-frequency applications, necessitating the development of materials with improved dielectric properties for maintaining signal transmission speed and quality in high-frequency electronic products.
Innovation Solution
A composition comprising an oligomer with a specific structure, a polymer with reactive functional groups, a photoinitiator, a thermal initiator, and a photoacid generator, which is processed through coating, thermal treatment, and light irradiation to produce a cured product with a low dielectric constant and dissipation factor, enhancing patternability and solder resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional epoxy resin is used as insulating material, then the material provides good mechanical strength and adhesion, but it exhibits high dielectric constant and dielectric dissipation factor causing signal delay and loss in high frequency applications
Solution Approach 1:
The patent uses a composite material system combining polyether oligomer, polymer with reactive functional groups, photoinitiator, thermal initiator, and photoacid generator. This composite composition achieves low dielectric constant (Dk < 2.6 at 60 GHz) and low dissipation factor (Df < 0.0088 at 10 GHz) while maintaining mechanical strength and adhesion properties required for PCB applications
Solution Approach 2:
The patent changes the chemical composition parameters by using polyether oligomer with specific molecular weight (1,000-5,000) and specific structural formulas, combined with polymers having at least two reactive functional groups. This parameter optimization enables the cured product to achieve Dk < 2.6 at 60 GHz and Df < 0.0088 at 10 GHz, resolving the signal transmission quality issue
2Reliability
If insulating materials with low dielectric constant are developed for high-frequency operation, then signal transmission speed and quality improve, but the material must simultaneously exhibit high thermal stability and patternability which are difficult to achieve together
Solution Approach 1:
The patent creates a multi-functional material system that simultaneously provides: (1) low dielectric constant for high-frequency operation, (2) high thermal stability through crosslinking cure mechanism, and (3) patternability through photoacid generator-enabled lithography. The composition acts as a universal solution meeting all three requirements
Solution Approach 2:
The patent incorporates photoacid generator and photoinitiator in the composition before curing, enabling preliminary patterning action through light exposure. This allows the material to be patterned before final thermal curing, achieving both low dielectric properties and patternability in a single material system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting insulating material exhibits a low dielectric constant and dissipation factor, improving signal transmission and solder resistance, making it suitable for high-frequency substrates and maintaining pattern integrity.
Implementation Method 1
irradiating the coating with a light source
Implementation Method 2
subjecting the coating to a first thermal treatment
Data Source
AI summary
A composition, an insulating material, and a method for preparing an insulating material are provided. The composition includes (a) 100 parts by weight of oligomer of Formula (I)(b) 20-50 parts by weight of polymer having at least two reactive functional groups, wherein the reactive functional group is a reactive-double-bond-containing functional group; (c) 1-5 parts by weight of photoinitiator; (d) 0.5-2 parts by weight of thermal initiator; and (e) 0.5-2 parts by weight of photoacid generator.