Low-Dielectric Encapsulation Composition for OLED Touch Sensitivity

The patent changes the dielectric constant parameter of the encapsulation material from conventional high values to a specific low range (2.0-2.9). This parameter change resolves the contradiction by selecting materials with low dielectric constants that prevent polarization under electric fields, thereby maintaining both electrical insulation and touch sensitivity.

The patent applies different material properties to different functional regions: the encapsulation layer uses low-dielectric constant materials specifically optimized for touch sensitivity, while other structural components may use different materials optimized for mechanical strength or other properties. This local differentiation allows each region to optimize its specific function without compromising overall device performance.

The patent employs composite encapsulation structures combining organic encapsulation layers with inorganic barrier layers. The organic layer provides flexibility and stress relief, while the inorganic layer provides superior moisture and oxygen barrier properties. This composite approach achieves both effective protection and extended device lifespan by leveraging the complementary strengths of different material types.

The patent replaces conventional thick inorganic barrier layers with a thinner organic encapsulation layer containing specific low-dielectric constant materials. This substitution reduces mechanical stress and polarization effects while maintaining adequate protection through optimized material composition and the addition of targeted barrier layers only where needed, rather than using thick uniform inorganic layers throughout.