Low-Dielectric Resin Composition for High-Speed IC Substrates
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Solution Overview
Problem
Conventional build-up materials for IC substrates have high dielectric losses, which are not suitable for applications requiring high-frequency and high-speed data transmission.
Innovation Solution
A low-dielectric resin composition is developed, comprising an epoxy resin, an active ester compound, a hardening agent, and an inorganic filler material, with specific weight percentages and ratios to achieve reduced dielectric constants and dissipation factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional build-up materials are used for IC substrates, then the material structure is simple and easy to manufacture, but the dielectric loss is high which is not suitable for high-frequency and high-speed data transmission
Solution Approach 1:
The patent applies composite materials by combining multiple resin components (cyclic carbonate resin, cyclic carboxylate resin, and their copolymer) with specific functional groups and structures. This multi-component system achieves low dielectric loss (Df ≤ 0.008 at 10 GHz) while maintaining processability, resolving the contradiction between energy loss reduction and manufacturing complexity.
Solution Approach 2:
The patent utilizes parameter changes by controlling the molecular weight, functional group content, and compositional ratios of the resin components. By adjusting these parameters, the material achieves optimal dielectric properties (Dk = 2.5-4.0, Df ≤ 0.008) while maintaining appropriate viscosity and curing characteristics for manufacturing.
2Speed
If the dielectric constant is reduced for high-speed transmission, then the data transmission speed improves, but the material composition becomes more complex
Solution Approach 1:
The patent employs composite materials consisting of cyclic carbonate resin and cyclic carboxylate resin in specific ratios. This composite structure achieves the required dielectric constant (Dk = 2.5-4.0) for high-speed transmission while managing the complexity through synergistic component selection and optimized formulation.
Solution Approach 2:
The patent applies local quality by incorporating specific functional groups (carboxyl, hydroxyl, ether, ester) at controlled concentrations within the resin system. These localized functional regions contribute to lowering the dielectric constant while maintaining overall material processability and curing performance.
3Loss of energy
If inorganic filler material content is increased to reduce dielectric constant, then the dielectric properties improve, but the viscosity and processability may deteriorate
Solution Approach 1:
The patent applies parameter changes by optimizing the molecular weight and functional group content of the resin components. These parameter adjustments balance the viscosity increase from inorganic fillers with the resin's flow characteristics, maintaining processability while achieving the required dielectric properties (Dk = 2.5-4.0, Df ≤ 0.008).
Solution Approach 2:
The patent uses local quality by incorporating specific functional groups (carboxyl, hydroxyl, ether, ester) at controlled concentrations that provide both dielectric performance and compatibility with inorganic fillers. This localized functional distribution improves filler-resin interaction, maintaining processability while reducing dielectric loss.
Data Source
AI summary
A low-dielectric resin composition is provided. The low-dielectric resin composition includes: an epoxy resin, an active ester compound, a hardening agent, and an inorganic filler material. Based on a total weight of the low-dielectric resin composition being 100 wt %, a content of the epoxy resin ranges from 5 wt % to 30 wt %, a content of the active ester compound ranges from 5 wt % to 40 wt %, a content of the hardening agent ranges from 0.1 wt % to 20 wt %, and a content of the inorganic filler material is not less than 40 wt %. A ratio of the content of the active ester compound relative to the content of the hardening agent ranges from 0.5 to 20.