Low-Dielectric Resin Composition With Latent Crosslinking for PCB Laminates
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Solution Overview
Problem
Current materials for copper-clad laminates in printed circuit boards fail to meet the demands for low dissipation factor, heat resistance, and toughness, and resin raw materials have a shortened shelf life due to excessive reactivity.
Innovation Solution
A compound represented by Formula (I) is synthesized through hydrosilylation between vinylphenoxy cyclophosphazene and a Si—H bond-containing silane compound, which is incorporated into a resin composition with a vinyl group-containing polyphenylene ether resin and crosslinking agent to form prepregs, resin films, laminates, and printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin raw materials with high reactivity are used to improve curing performance, then heat resistance and mechanical properties are improved, but shelf life is shortened
Solution Approach 1:
The patent introduces a latent crosslinking mechanism where the silane-modified phosphazene compound is pre-prepared with Si-H bonds that remain dormant during storage. The crosslinking reaction is activated only when exposed to moisture during the curing process, allowing the material to maintain stability during storage while achieving high reactivity and heat resistance when needed.
Solution Approach 2:
The patent changes the chemical state of the crosslinking agent from fully reactive to latent/reactive-on-demand. By modifying phosphazene with silane groups that require moisture activation, the material transitions from a state of high reactivity (short shelf life) to a state of controlled reactivity (long shelf life with maintained curing performance).
2Reliability
If crosslinking density is increased to improve heat resistance, then thermal properties are improved, but dielectric properties deteriorate
Solution Approach 1:
The patent introduces phosphazene rings into the crosslinked network structure. These phosphazene units provide localized regions with high heat resistance and flame retardancy while maintaining low dielectric loss. The silane-modified phosphazene compound creates a heterogeneous network where crosslinked regions provide thermal stability and phosphazene regions maintain electrical properties.
Solution Approach 2:
The patent creates a composite crosslinked structure combining silane crosslinking networks with phosphazene-containing units. This composite approach allows simultaneous achievement of high heat resistance (from crosslinking) and good dielectric properties (from phosphazene's inherent low loss characteristics).
3Object-affected harmful factors
If conventional phosphazene compounds are used to improve flame retardancy, then fire resistance is improved, but reactivity and processability are poor
Solution Approach 1:
The patent pre-modifies phosphazene with silane groups to create a latent crosslinking agent. This preliminary modification allows the compound to be stored stably and then activated on-demand during curing, solving the reactivity problem while maintaining flame retardancy. The silane groups serve as dormant reactive sites that become active under curing conditions.
Solution Approach 2:
The silane groups act as intermediaries between the phosphazene core and the crosslinking network. They provide a bridge that enables controlled reactivity: the Si-H bonds can react with moisture or hydroxyl groups during curing to form crosslinks, while the phosphazene core maintains its flame retardant function. This intermediary mechanism solves the contradiction between stability and reactivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compound improves glass transition temperature, dielectric properties, heat resistance, and flame retardancy while extending the shelf life and reaction window, enhancing the performance of copper-clad laminates.
Implementation Method 1
improving glass transition temperature
Implementation Method 2
heat resistance
Implementation Method 3
flame retardancy
Data Source
AI summary
The present disclosure provides a compound represented by Formula (I) and a manufacturing method thereof, a resin composition comprising the compound, and an article made from the resin composition. The resin composition comprises the compound represented by Formula (I), vinyl group-containing polyphenylene ether resin and vinyl-containing crosslinking agent. The article comprises a prepreg, a resin film, a laminate, a printed circuit board or a cured insulator that has improvements in one or more properties including glass transition temperature, dielectric constant, dissipation factor, thermal resistance after moisture absorption, flame retardancy, inner resin flow, and drop ball test.