Low-Energy Layer in Display Panel Bending Area
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Solution Overview
Problem
Existing display panels face challenges in enhancing the durability of bending areas, which are prone to strain and stress when curved, leading to potential cracks and reduced performance.
Innovation Solution
The display panel incorporates a thin film encapsulating layer with a specific structure, including a base layer, a light emitting element layer, and a thin film encapsulating layer. This layer features a first encapsulating inorganic film, an encapsulating organic film, and a second encapsulating inorganic film, with a low-energy layer disposed on the first encapsulating inorganic film in the bending area. The surface energy of the low-energy layer is lower than that of the first encapsulating inorganic film, and the upper and lower surfaces of the second encapsulating inorganic film have curved surfaces in the bent state, enhancing the bending area's durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional thin film encapsulating layer structure is used, then the display panel can be manufactured with standard processes, but the bending area is prone to strain and stress leading to potential cracks and reduced durability
Solution Approach 1:
The patent applies local quality by introducing a low-energy layer specifically in the bending area of the thin film encapsulating layer, while maintaining the standard structure in other areas. This localized modification reduces stress concentration at the bending area without affecting the overall structural integrity and manufacturing process of the display panel.
Solution Approach 2:
The patent changes the surface energy parameter of the thin film encapsulating layer by introducing a low-energy layer in the bending area. This parameter change (reducing surface energy) helps minimize adhesion forces that cause strain and stress during bending, thereby improving durability and resistance to cracks in the bending area.
2Reliability
If the thin film encapsulating layer has a multi-layer structure with different surface energies, then the bending area durability is enhanced, but the manufacturing process complexity increases
Solution Approach 1:
The patent maintains a relatively simple overall structure while introducing a low-energy layer only in the bending area. This localized approach adds minimal structural complexity compared to modifying the entire encapsulating layer, achieving improved durability with acceptable manufacturing complexity.
Solution Approach 2:
The patent uses composite materials by combining the low-energy layer with the existing thin film encapsulating layer structure. This composite structure leverages the properties of both materials (the low-energy layer for reduced stress and the encapsulating layer for protection) to achieve enhanced durability without requiring a completely new design.
3Reliability
If the upper surface of the second encapsulating inorganic film has a curved surface in the bent state, then the bending area durability is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary action by pre-forming the curved surface on the upper surface of the second encapsulating inorganic film before the bending process. This pre-curved configuration allows the film to naturally follow the bending curvature without creating stress concentration, thereby improving durability while maintaining reasonable manufacturing precision requirements.
Solution Approach 2:
The patent utilizes spheroidality by introducing a curved surface on the upper surface of the second encapsulating inorganic film that corresponds to the bending area. This curvature matches the bending geometry of the display panel, allowing the encapsulating layer to accommodate bending stresses more effectively and improve durability without requiring excessive manufacturing precision.
Data Source
AI summary
A display panel, including a display area including a front area and a bending area, and a non-display area, includes a base layer, a light emitting element layer including a light emitting element and disposed on the base layer, and a thin film encapsulating layer disposed on the light emitting element layer. The thin film encapsulating layer includes a first encapsulating inorganic film disposed on the light emitting element layer, an encapsulating organic film disposed on the first encapsulating inorganic film, a second encapsulating inorganic film disposed on the encapsulating organic film, and a low-energy layer disposed on the first encapsulating inorganic film to correspond to the bending area and covered by the encapsulating organic film, and a surface energy of the low-energy layer is lower than a surface energy of the first encapsulating inorganic film.