Electronic Component Pressing With Low-Friction Sheet for Circuit Bonding

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Solution Overview

Problem

Existing methods for forming electrical circuits using three-dimensional shaping devices often fail to ensure a reliable electrical connection between electronic components and metal wiring lines due to inadequate pressing techniques.

Innovation Solution

A method and device that apply a conductive fluid to a metal wiring line, mount an electronic component with its electrode in contact with the fluid, and press the component using a pressing member with a sheet having a lower friction coefficient than the pressing member's surface, ensuring a stable connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the electronic component is pressed directly by the pressing member without a sheet, then the pressing force is sufficient, but the electrical connection between the electrode and metal wiring line is unreliable

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidpressing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A sheet is introduced as an intermediary between the pressing member and the electronic component. This sheet has a surface with a coefficient of friction lower than that of the pressing member, allowing it to reduce friction during pressing while maintaining alignment and contact pressure for reliable electrical connection between the electrode and metal wiring line.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a sheet with low friction coefficient is introduced between the electronic component and pressing member, then the electrical connection is improved, but the device structure becomes more complex

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidpressing device structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The sheet serves as a simple intermediary component that can be easily integrated into the existing pressing device without requiring complex structural modifications. The sheet's primary function is to provide a low-friction surface that maintains component alignment while reducing resistance during pressing, thereby improving electrical connection reliability with minimal added complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If the pressing member directly contacts the electronic component, then the pressing process is simple, but the contact area between electrode and conductive fluid is insufficient

Engineering Contradiction:
Improvecontact area precisionVSAvoidpressing operation simplicity
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The sheet acts as a mediator that enhances the contact area between the electrode and conductive fluid during pressing. By providing a low-friction surface, it allows for better distribution of contact pressure and ensures adequate contact area for reliable electrical connection, while the overall pressing operation remains straightforward.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the electrical connection between the electronic component and the metal wiring line by increasing the contact area and maintaining alignment during pressing, thereby improving conductivity.

Implementation Method 1

a sheet including a surface with a coefficient of friction lower than a coefficient of friction of at least a part of a surface of the pressing member that faces the electronic component

Methodology Applied
Scientific EffectFriction: Friction

Data Source

PatentUS20250226357A1Electrical circuit formation method and electrical circuit formation device
Publication Date: 2025.07.10 FUJI CORP
  • US20250226357A1 patent drawing
  • US20250226357A1 patent drawing
  • US20250226357A1 patent drawing

AI summary

There is provided an electrical circuit formation method including: a fluid application step of applying a conductive fluid to a planned mounting position of an electrode of an electronic component on a metal wiring line formed on a resin layer, a mounting step of mounting the electronic component such that the electrode comes into contact with the conductive fluid; and a pressing step of pressing the electronic component mounted in the mounting step relative to the resin layer by a pressing member in a state in which a sheet including a surface with a coefficient of friction lower than a coefficient of friction of at least a part of a surface of the pressing member that faces the electronic component is sandwiched between the electronic component and the pressing member.