Low Inductance Busbar Assembly with Overlapping Bridge Electrodes

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Solution Overview

Problem

Conventional busbar systems in electric and hybrid electric vehicles experience voltage spikes due to high inductance, which complicates the design and increases part count and assembly complexity, while also being costly.

Innovation Solution

A low inductance busbar assembly is designed with overlapping conductive bridge electrodes and a single fastener configuration, reducing inductance by extending current pathways and simplifying assembly with fewer parts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional busbar systems are used with separate connector terminals on each electrode, then electrical isolation between electrodes is maintained, but part count and assembly complexity increase

Engineering Contradiction:
Improveelectrical isolationVSAvoidassembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate connector terminals into a single integrated connector assembly that interfaces with both positive and negative busbar electrodes simultaneously. This merging reduces the number of separate fasteners and assembly steps while maintaining electrical isolation through the connector's internal design, directly resolving the contradiction between reliability and assembly complexity.

Inventive Principle:
Principle #5Merging (Combining)

2Object-generated harmful factors

If current pathways are extended to reduce inductance, then voltage spikes are reduced, but the busbar system complexity increases

Engineering Contradiction:
Improvevoltage spikesVSAvoidbusbar system complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The patent extends current pathways by adding vertical overlap between busbar electrodes in the z-dimension, rather than simply lengthening horizontal pathways. This dimensional approach reduces inductance and voltage spikes while maintaining a compact footprint and avoiding excessive system complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Object-generated harmful factors

If overlapping busbar electrodes are used to reduce inductance, then voltage spikes are reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvevoltage spikesVSAvoidalignment precision
Core Design Contradiction:
Object-generated harmful factorsVSManufacturing precision

Solution Approach 1:

The connector assembly is designed to establish equipotential connections across multiple busbar electrodes simultaneously, ensuring that voltage potentials are equalized at connection points. This design approach reduces sensitivity to alignment variations and maintains manufacturing feasibility while achieving the voltage spike reduction benefits of overlapping electrodes.

Inventive Principle:
Principle #12Equipotentiality

Data Source

PatentUS7798833B2Low inductance busbar assembly
Publication Date: 2010.09.21 GM GLOBAL TECHNOLOGY OPERATIONS LLC
  • US7798833B2 patent drawing
  • US7798833B2 patent drawing
  • US7798833B2 patent drawing

AI summary

A busbar assembly for electrically coupling first and second busbars to first and second contacts, respectively, on a power module is provided. The assembly comprises a first terminal integrally formed with the first busbar, a second terminal integrally formed with the second busbar and overlapping the first terminal, a first bridge electrode having a first tab electrically coupled to the first terminal and overlapping the first and second terminals, and a second tab electrically coupled to the first contact, a second bridge electrode having a third tab electrically coupled to the second terminal, and overlapping the first and second terminals and the first tab, and a fourth tab electrically coupled to the second contact, and a fastener configured to couple the first tab to the first terminal, and the third tab to the second terminal.