Imaging System Power Electronics Assembly With Low-Inductance Connections
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Solution Overview
Problem
Conventional power electronics assemblies in imaging systems, such as those used in interventional radiology and CT systems, suffer from space-inefficient component packaging, undesirable parasitic inductance, and unreliable electrical connections, particularly due to the use of twisted cables and vertically aligned gate driver boards, which hinder integration into space-constrained environments and reduce inverter capability and reliability.
Innovation Solution
A power electronics assembly is designed with a compact layout that layers a gate board, power board, and power modules using interconnection boards instead of twisted wires, allowing for robust electrical connections and reducing parasitic inductance, while utilizing the space between a heat sink and power board for gate board placement, resulting in a more space-efficient and reliable design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If twisted cables are used to connect gate driver boards to power modules, then electrical connections can be established, but parasitic inductance increases and connection reliability decreases
Solution Approach 1:
The patent extracts and eliminates the twisted cable connections from the system, replacing them with direct PCB trace connections and terminal block connections. This removal of the harmful element (twisted cables with high parasitic inductance) directly resolves the contradiction by providing a connection method with significantly lower parasitic inductance while maintaining electrical connectivity between gate driver boards and power modules.
Solution Approach 2:
The patent introduces terminal blocks as intermediary connection elements between the gate driver boards and power modules. These terminal blocks provide standardized, low-inductance connection points that replace the problematic twisted cable arrangements. The intermediary terminal blocks enable reliable electrical connections with controlled impedance and minimized parasitic effects.
2Ease of manufacture
If gate driver boards are vertically aligned, then assembly is simplified, but space efficiency decreases and integration into space-constrained environments becomes difficult
Solution Approach 1:
The patent transitions from a vertical stacking arrangement to a horizontal planar layout of gate driver boards. By arranging the boards side-by-side on the same PCB plane rather than stacking them vertically, the design achieves comparable assembly simplicity while dramatically reducing the vertical height and overall volume of the power electronics assembly, enabling integration into space-constrained medical imaging environments.
Solution Approach 2:
The patent merges multiple gate driver boards and power modules onto a single standardized PCB platform with integrated mounting structures. This consolidation approach maintains assembly simplicity through unified manufacturing processes while optimizing the spatial arrangement to minimize overall assembly volume, allowing compact integration into constrained environments.
3Ease of manufacture
If conventional power electronics assembly is used, then standard manufacturing processes can be applied, but space efficiency and integration capability into constrained environments are reduced
Solution Approach 1:
The patent develops a universal power electronics assembly platform with standardized PCB designs, modular gate driver boards, and interchangeable terminal blocks. This universal platform maintains compatibility with standard manufacturing processes while being adaptable to various space constraints and integration requirements in different medical imaging systems. The modular design allows the same basic architecture to be configured for different applications by simply adjusting the arrangement and number of modules.
Data Source
AI summary
Systems and methods for a power electronics assembly. The power electronics assembly includes, in one example, a gate board electronically connected to a power board, a plurality of power modules which each include multiple power terminals which are electronically connected to the power board via multiple attachment devices, and multiple interconnection boards. In the power electronics assembly, each of the plurality of interconnection boards are electronically connected to the gate board via multiple gate board terminals and one of the power modules via multiple control terminals.