Low Inductance Laser Module for TOF 3D Camera
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Solution Overview
Problem
TOF-3D cameras face challenges in acquiring an acceptable range image due to insufficient light intensity from light pulses, which is limited by cost and heat dissipation constraints, and the high repetition rates of light pulses and exposure periods exceed megahertz frequencies, complicating the design of illumination systems.
Innovation Solution
A light source module with a semiconductor light source and a low inductance electrical connector, where the connector is a small printed circuit board mount with short, wide conducting traces that carry current and function as heat dissipation channels, reducing inductance and enhancing energy efficiency and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If light intensity from the light source is increased to improve signal-to-noise ratio, then measurement precision is improved, but heat dissipation requirements increase and cost increases
Solution Approach 1:
The system uses pulsed illumination instead of continuous light emission, operating at repetition frequencies greater than 1 MHz with pulse durations of a few nanoseconds. This periodic operation allows the light source to dissipate heat between pulses, enabling high peak intensities for improved signal-to-noise ratio while maintaining acceptable average power and heat dissipation levels.
2Productivity
If light pulse repetition frequency is increased to improve productivity, then measurement speed is improved, but device complexity increases due to fast switching demands
Solution Approach 1:
The electrical connector integrates multiple functions: it provides electrical connections for power and control signals, serves as a thermal management interface through thermally conducting traces, and enables mechanical support for the semiconductor light source. This consolidation reduces the number of separate components and simplifies the overall device structure despite the high-frequency operation requirements.
3Area of stationary object
If footprint of electronic components is reduced to improve compactness, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The conducting traces on the electrical connector perform multiple functions simultaneously: they provide low-inductance electrical pathways for high-frequency current switching, serve as thermal conduction channels for heat dissipation from the light source, and provide mechanical support structure. This multi-functionality allows the traces to be designed with optimized dimensions that balance compactness with manufacturability, rather than requiring separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient energy use and moderate transient voltage swings, allowing for high-frequency light pulse production while maintaining a compact size, facilitating the production of multiple modules inexpensively and improving the signal-to-noise ratio for distance measurements in TOF-3D cameras.
Implementation Method 1
low inductance electrically conducting traces that carry current from the power supply to and from the semiconductor light source
Implementation Method 2
The traces also function as thermally conducting channels for dissipation of heat generated by operation of the semiconductor light source
Data Source
AI summary
An embodiment of the invention provides a low inductance light source module, which may have a small footprint and comprise a printed circuit board (PCB) mount having first and second conducting traces formed on a side of the PCB mount and a semiconducting light source having a first electrical contacts for receiving power that is bonded to the first conducting trace with a conducting bonding material and a second electrical contact for receiving power that is connected by at least one bondwire to the second conducting trace.