Integrated Low-k Spacer for RF Magnetic Field Control
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Solution Overview
Problem
Existing magnetically controlled RF signal distribution devices face challenges in achieving uniform magnetic field control and efficient RF bandwidth definition due to the separate attachment of spacers during device assembly, which increases costs and processing time.
Innovation Solution
The method involves screen printing a low-k dielectric spacer directly onto the substrate at the wafer level before assembly, followed by firing as a unit to form a sintered glass bond, eliminating the need for epoxy layers and allowing for more uniform thickness and tighter tolerance control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the spacer is attached separately during device assembly, then the device can be assembled with modular components, but the processing time and manufacturing cost increase
Solution Approach 1:
The spacer is integrated directly into the substrate during the substrate fabrication process rather than being attached separately during device assembly. This merging of the spacer attachment step with substrate fabrication eliminates the need for separate spacer attachment operations, reducing processing time and manufacturing steps while maintaining modular component benefits
2Ease of manufacture
If the spacer is attached separately during device assembly, then component flexibility is maintained, but the number of processing steps increases
Solution Approach 1:
The spacer attachment operation is merged with the substrate fabrication process. The spacer is applied, patterned, and cured as part of the substrate manufacturing sequence, eliminating it from the separate device assembly workflow. This reduces the total number of processing steps while maintaining the ability to produce modular device components
3Reliability
If conventional spacer materials are used, then the spacer provides adequate isolation, but the dielectric constant is too high requiring thicker spacers
Solution Approach 1:
The dielectric constant parameter of the spacer material is changed from conventional high-k materials to low-k materials. This parameter change allows the spacer to provide the same magnetic field isolation and electrical insulation properties with a reduced thickness, enabling thinner spacer designs while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of components and processing steps, saving cost and time, while ensuring better control of magnetic field and field spread, leading to improved device reliability and performance.
Implementation Method 1
firing as a unit to form a sintered glass bond
Data Source
AI summary
A method of fabricating a portion of magnetically controlled signal distribution device includes receiving a substrate and screen printing a low-k dielectric spacer over an upper surface of the surface from a low-k dielectric paste. The method also includes firing the substrate after the spacer has been screen printed thereon, forming an adhesive layer on top of the spacer and securing a magnet to a top of the adhesive layer.