Low Loop Inductance Electronic Module Bus Structure

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Solution Overview

Problem

High loop inductance in power converter modules leads to voltage overshoots, oscillations, and unwanted switching behaviors, making it challenging to maintain proper insulation between current-carrying paths while ensuring low inductance values.

Innovation Solution

The electronic module assembly incorporates a bus structure with electrically conductive plates and insulating plates, where the insulating plate is not in direct contact with the conductive plates in certain portions to form cavities, reducing inductance and allowing for proper insulation, and the modules are coupled such that a portion of one bus is disposed within the cavities of another, creating an overall lower loop inductance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If current carrying sheets of electrically conductive material are positioned as close together as possible in a bus, then the inductance of the bus is decreased, but the room for a magnetic field increases resulting in increased inductance

Engineering Contradiction:
Improveinductance reductionVSAvoidmagnetic field interference
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The bus structure is segmented into multiple portions with alternating orientations of conductive sheets. This segmentation allows the magnetic fields from adjacent sheets to oppose and cancel each other, reducing overall inductance while maintaining close positioning of conductive materials.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the bus have conductive sheets oriented in different directions (alternating orientations). This local variation in quality enables magnetic field cancellation in specific regions while maintaining low inductance characteristics throughout the overall structure.

Inventive Principle:
Principle #3Local quality

2Productivity

If current carrying sheets are positioned close together to achieve low inductance, then inductance is reduced, but proper insulation between positive and negative potentials becomes challenging

Engineering Contradiction:
Improveinductance valueVSAvoidinsulation between potentials
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

Electrically insulating sheets are introduced as intermediary elements between the positively and negatively charged conductive sheets. These insulating sheets maintain close positioning of conductive materials for low inductance while providing necessary electrical insulation and defining cavities for magnetic field management.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If insulating plate is positioned to maintain insulation between conductive plates, then insulation is ensured, but inductance increases due to reduced magnetic field containment

Engineering Contradiction:
Improveinsulation between potentialsVSAvoidinductance value
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The insulating plate is segmented such that it does not completely contact the conductive plates in all areas, forming cavities. This segmentation allows magnetic fields to be contained within specific regions while maintaining insulation where needed, optimizing the balance between insulation and inductance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The design transitions from a two-dimensional planar arrangement to a three-dimensional structure with cavities formed by the insulating plate. This dimensional change allows magnetic fields to be contained within cavities while maintaining insulation between conductive plates, reducing overall inductance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Reliability

If modules are connected with traditional bus structures, then insulation is maintained, but loop inductance remains high causing voltage overshoots and oscillations

Engineering Contradiction:
Improveinsulation standardsVSAvoidloop inductance
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

One bus structure is positioned within the cavities of another bus structure, creating a nested configuration. This nesting allows the magnetic fields of the two buses to cancel each other, significantly reducing loop inductance while maintaining insulation through the insulating plates.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention merges the functions of insulation and magnetic field management into a single integrated bus structure. The insulating plates serve both to provide electrical insulation and to define cavities for magnetic field containment, while the alternating sheet orientations provide both structural integrity and inductance reduction.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces loop inductance, minimizing voltage overshoots and oscillations, while maintaining adequate insulation, thus enhancing the operational stability and efficiency of power converters.

Implementation Method 1

Positioning these sheets of electrically conductive material close together results in a significant decrease in room for a magnetic field that may result in an increase in the inductance

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Data Source

PatentUS10021802B2Electronic module assembly having low loop inductance
Publication Date: 2018.07.10 GENERAL ELECTRIC CO
  • US10021802B2 patent drawing
  • US10021802B2 patent drawing
  • US10021802B2 patent drawing

AI summary

An electronic module is presented. The electronic module includes one or more electronic devices and a first bus electrically coupled to at least one of the one or more electronic devices. The first bus includes a first electrically conductive plate, a second electrically conductive plate, and a first electrically insulating plate disposed between the first electrically conductive plate and the second electrically conductive plate, where in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate. An electronic module assembly having low loop inductance is also presented.