Low-Loss Antenna Packaging Structure for Leakage and Capacitance
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Solution Overview
Problem
Conventional dielectric materials in antenna packaging structures suffer from high dielectric loss, leading to issues like current leakage and stray capacitance, which hinder miniaturization and reliability under high temperature and voltage conditions.
Innovation Solution
An antenna packaging structure with low dielectric loss tangent materials, including a substrate layer, interconnection structural members, an antenna support member, and a plastic packaging layer, where the interlayer dielectrics and antenna layers have dielectric loss values less than 0.01, and are supported by organic composite substrates or low-temperature co-fired ceramics, with electromagnetic shielding and moisture barriers to enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional dielectric materials (such as silicon or molding compounds) are used in antenna packaging structures, then the structure can be manufactured with conventional processes, but the dielectric loss is high leading to current leakage and stray capacitance problems
Solution Approach 1:
The patent changes the dielectric loss tangent parameter from conventional materials (>0.01) to low-loss materials (<0.01). The substrate layer uses materials with dielectric loss tangent less than 0.01, and the antenna support member also uses materials with dielectric loss tangent less than 0.01, thereby reducing dielectric loss and eliminating current leakage and stray capacitance problems while maintaining manufacturability
Solution Approach 2:
The patent employs composite material structures where the substrate layer combines chip circuit layers, antenna control layers, and antenna layers with low-loss dielectric materials. The antenna support member may be composed of organic composite substrates, plastic packaging parts, glass parts, or low-temperature co-fired ceramic parts, creating a composite packaging structure that achieves low dielectric loss while remaining manufacturable
2Reliability
If conventional dielectric materials are used in antenna packaging, then the packaging can be produced using standard processes, but the reliability under high temperature and high voltage conditions is poor
Solution Approach 1:
The patent specifies that the substrate layer includes materials with dielectric loss tangent less than 0.01 and the antenna support member uses materials with dielectric loss tangent less than 0.01. These parameter changes ensure reliable operation under high temperature and high voltage conditions by minimizing energy loss and maintaining electrical stability
Solution Approach 2:
The patent incorporates a plastic packaging layer that wraps the substrate layer, antenna support member, antenna layers, and chip to provide environmental protection before exposure to harsh conditions. Additionally, moisture barrier layers are integrated to prevent moisture ingress that could compromise reliability under high temperature and humidity conditions
3Volume of moving object
If conventional dielectric materials with higher dielectric loss are used, then the packaging structure can be simpler and easier to manufacture, but miniaturization of the packaging structure is hindered
Solution Approach 1:
The patent adopts low dielectric loss tangent materials (<0.01) for the substrate layer and antenna support member, which enable more efficient electromagnetic signal transmission and allow for compact antenna design. This material parameter change facilitates miniaturization of the packaging structure while maintaining manufacturability through established low-loss material processing techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure reduces current leakage and stray capacitance, enabling miniaturization and improved reliability under high temperature and humidity conditions while maintaining effective signal transmission.
Implementation Method 1
dielectric loss tangent values of interlayer dielectrics of the first antenna layer and the second antenna layer are less than 0.01, respectively
Data Source
AI summary
The present invention provides an antenna packaging structure and a manufacturing method thereof. An antenna and a chip are respectively disposed on two sides of a substrate layer, antenna layers are formed by an antenna support member, a first antenna layer located above the antenna support member and a second antenna layer located below the antenna support member together, and interlayer dielectrics of the antenna support member and the antenna layers are low dielectric loss materials, so that a heterogeneous and isomerous antenna structure is formed, thereby reducing the problems such as current leakage and stray capacitance in the packaging structure caused by dielectric loss, and reducing a size of the antenna packaging structure.