Low-Loss Substrate Composition for Temperature-Stable RF Dielectrics
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Solution Overview
Problem
Conventional resin and glass substrates exhibit significant changes in dielectric characteristics with frequency and temperature fluctuations, making them unsuitable for high-frequency communication devices used in varying environments, particularly outdoors where temperature ranges can be extreme.
Innovation Solution
Developed substrates with controlled dielectric loss tangent and relative permittivity across a wide temperature range (-40 to 150°C) and frequency range (10-35 GHz), ensuring stable signal transmission by maintaining a ratio of these properties within specific limits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin or glass substrates are used in high-frequency communication devices, then the devices can be manufactured with existing materials, but the dielectric characteristics change considerably with temperature fluctuations, making them unsuitable for stable high-frequency operation
Solution Approach 1:
The patent applies parameter changes by precisely controlling the dielectric loss tangent and relative permittivity parameters of the substrate material within specific ranges. By regulating these electromagnetic parameters, the substrate maintains stable dielectric characteristics across a wide temperature range from -40°C to 150°C, enabling reliable high-frequency operation in diverse environmental conditions.
Solution Approach 2:
The patent employs composite materials by formulating a substrate that combines multiple components including glass powder, organic binder, and inorganic filler in specific proportions. This composite structure achieves both low dielectric loss and temperature stability, resolving the contradiction between material availability and performance reliability.
2Loss of energy
If substrates with low dielectric loss are used for high-frequency signals, then signal quality is improved, but the substrates must maintain stable dielectric characteristics across wide temperature ranges which conventional materials cannot achieve
Solution Approach 1:
The patent applies parameter changes by precisely controlling the dielectric loss tangent and relative permittivity parameters of the substrate material within specific ranges. By regulating these electromagnetic parameters, the substrate maintains stable dielectric characteristics across a wide temperature range from -40°C to 150°C, enabling reliable high-frequency operation in diverse environmental conditions.
Data Source
AI summary
The present invention relates to a substrate having a dielectric loss tangent (A) as measured at 20° C. and 10 GHz of 0.1 or less, a dielectric loss tangent (B) as measured at 20° C. and 35 GHz of 0.1 or less, and a ratio [a dielectric loss tangent (C) as measured at an arbitrary temperature in a range of −40 to 150° C. and at 10 GHz]/[the dielectric loss tangent (A)] of 0.90-1.10, or a substrate having a relative permittivity (a) as measured at 20° C. and 10 GHz of 4 or more and 10 or less, a relative permittivity (b) as measured at 20° C. and 35 GHz of 4 or more and 10 or less, and a ratio [a relative permittivity (c) as measured at an arbitrary temperature in a range of −40 to 150° C. and at 10 GHz]/[the relative permittivity (a)] of 0.993-1.007.

