Low Modulus Insulating Structure for Thermal Stress Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic modules are prone to damage due to temperature fluctuations, leading to mechanical stress and potential crack formation during temperature cycles.
Innovation Solution
An electronic module with an encapsulation structure that includes an electrically conductive structure and an electrically insulating structure made from a material with a low modulus of elasticity, which remains relatively constant (≤10 GPa) across a temperature range of −40°C to +150°C, providing flexibility and protection against mechanical damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional materials (e.g., FR-4) are used for the electrically insulating structure, then the structural strength and rigidity are sufficient, but the module becomes vulnerable to mechanical damage and crack formation during temperature cycles
Solution Approach 1:
The patent changes the material parameter of the electrically insulating structure by selecting materials with low modulus of elasticity (e.g., polyimide, polyester, polyethylene terephthalate) instead of conventional high-modulus materials like FR-4. This parameter change allows the material to deform elastically under thermal stress, absorbing mechanical energy and preventing crack formation while maintaining electrical insulation properties.
Solution Approach 2:
The patent employs composite material strategies by combining the low-modulus electrically insulating material with other materials having different mechanical properties. This creates a composite structure that balances flexibility for stress absorption with sufficient structural integrity, resolving the contradiction between rigidity and thermal expansion accommodation.
2Object-affected harmful factors
If a material with very low modulus of elasticity is used to absorb thermal stress, then the protection against mechanical damage improves, but the structural stability and electrical connection reliability may deteriorate
Solution Approach 1:
The patent applies local quality by using low-modulus materials specifically in regions where thermal stress concentration occurs, such as around electrical contacts and mounting points, while maintaining adequate structural stability in other regions. This localized application provides targeted protection without compromising overall structural integrity.
Solution Approach 2:
The patent carefully selects materials with low but not excessively low modulus of elasticity, establishing an optimal parameter range that provides sufficient flexibility for stress absorption while maintaining adequate structural stability. This controlled parameter change resolves the contradiction between protection and stability.
3Manufacturing precision
If rigid materials are used to maintain structural integrity, then the manufacturing precision and assembly accuracy are improved, but the module becomes susceptible to damage during thermal cycling
Solution Approach 1:
The patent changes the mechanical parameter of the insulating material from high modulus (rigid) to low modulus (flexible), which maintains assembly precision during manufacturing while enabling the material to accommodate dimensional changes during thermal cycling, thus preventing damage.
Solution Approach 2:
The patent introduces dynamic behavior to the insulating structure by using materials that can elastically deform in response to thermal stress, allowing the structure to adapt to temperature changes while maintaining functional integrity, unlike static rigid materials that are prone to fracture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a material with a low modulus of elasticity in the insulating structure enhances the module's robustness against temperature cycles, preventing crack formation and ensuring reliable electrical coupling and extended service life.
Implementation Method 1
Such a material is elastic and flexible and therefore allows protection against undesirable cracks or other mechanical damage, despite temperature fluctuations
Data Source
AI summary
Electronic module comprising at least one electronic chip, an encapsulation structure in which the at least one electronic chip is at least partially encapsulated, an electrically conductive structure for the electrically conductive contacting of the at least one electronic chip, and an electrically insulating structure which is at least partially formed from a material having a low modulus of elasticity, wherein a variation of the value of the modulus of elasticity is at the most 10 GPa in a temperature range between −40° C. and +150° C.