Low-Outgassing Cable Covering Material for Semiconductor Vacuum Tools
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electric wires and cables used in semiconductor manufacturing apparatuses emit outgassing components that contaminate the vacuum environment, particularly when exposed to EUV light, which is detrimental to the precision of microfabrication processes.
Innovation Solution
A covering material for electric wires and cables is developed, satisfying specific conditions to minimize gas emission and outgassing, including a gas emission rate of 2.0 × 10 -9< Pa·m 3< /s/cm 2< or lower and a partial pressure of outgassing components with a molecular weight of 200 or less at 1.0 × 10 -6< Pa or lower, using materials like fluororesins and ceramics to enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cable materials are used in vacuum devices, then the cable provides basic insulation and electrical functionality, but the cable emits outgassing components that contaminate the vacuum environment
Solution Approach 1:
The patent applies composite materials by combining fluororesin (which provides low outgassing properties) with ceramic particles (which enhance thermal stability and reduce outgassing). This composite structure allows the cable covering to maintain electrical insulation functionality while significantly reducing outgassing emissions that would contaminate the vacuum environment, thereby resolving the contradiction between reliability and harmful emissions.
Solution Approach 2:
The patent changes the chemical composition parameters of the cable covering material by specifying fluororesin as the base material and adding ceramic particles in controlled amounts. This parameter change transforms the material properties to achieve lower outgassing rates while maintaining the required electrical and mechanical performance, thus improving vacuum environment cleanliness without sacrificing cable functionality.
2Reliability
If the cable covering material is designed to reduce outgassing, then vacuum contamination is reduced, but the material selection and manufacturing process become more complex
Solution Approach 1:
The patent applies local quality by concentrating the complexity only where necessary - the cable covering material formulation is specialized with fluororesin and ceramic particles to reduce outgassing, while the rest of the cable structure (conductors, insulation layers) can use conventional materials. This localized approach to material complexity minimizes the overall system complexity while achieving the vacuum cleanliness requirement.
Data Source
AI summary
The disclosure aims to provide a covering material for an electric wire or a cable for a semiconductor manufacturing apparatus, the covering material reducing emission of an outgassing component even when used in a vacuum. The disclosure also aims to provide an electric wire or a cable containing the covering material, a vacuum device for a semiconductor manufacturing apparatus, a semiconductor manufacturing apparatus, and a method for producing a covering material for an electric wire or a cable. The disclosure provides a covering material for an electric wire or a cable, the covering material being for use in a vacuum device in a semiconductor manufacturing apparatus, the covering material satisfying the following condition A: (condition A) a sample has a gas emission rate per unit surface area of 2.0 × 10-9 Pa·m3/s/cm2 or lower after being left to stand at 20°C to 30°C and 1.0 × 10-2 to 1.0 × 10-4 Pa for 48 hours.


