Low-Pressure Liquid Cooling for Computer Components
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Solution Overview
Problem
High-performance computing environments face increased costs and inefficiencies due to high-pressure liquid cooling systems, which are prone to pressure variations, leaks, and energy consumption, especially when adding or removing components.
Innovation Solution
A non-pressurized, low-pressure liquid cooling system that uses coolant at atmospheric or low pressure, circulating through thermally conductive jackets and channels in computer equipment modules, with in-feed branches acting as holding tanks to maintain consistent liquid flow and reduce the need for high-pressure pumps and expensive connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high pressure liquid cooling systems are used, then cooling efficiency is improved, but system reliability deteriorates due to pressure variations and leaks
Solution Approach 1:
The patent changes the pressure parameter from high pressure (40-50 psi) to low pressure (less than 5 psi) while maintaining effective cooling through increased flow rate and optimized channel design. This parameter change resolves the contradiction by achieving cooling efficiency through flow dynamics rather than pressure differential.
Solution Approach 2:
The system dynamically adjusts liquid flow rate to compensate for lower pressure, maintaining cooling effectiveness. The flow rate is optimized based on the number of active components, allowing the system to adapt to changing thermal loads without requiring high pressure, thus improving reliability.
2Power
If high pressure pumps are used, then cooling capacity is improved, but energy consumption increases
Solution Approach 1:
The patent replaces high pressure pumps with low pressure pumps that operate at less than 5 psi, significantly reducing energy consumption. The cooling capacity is maintained through optimized liquid flow rate and direct contact cooling channels that maximize heat transfer efficiency without requiring high pressure.
Solution Approach 2:
The patent substitutes the mechanical high pressure pumping system with a low pressure system that relies on optimized flow dynamics and direct liquid-to-component contact. This replacement reduces the mechanical energy required while maintaining or improving cooling capacity through enhanced heat transfer surfaces and flow distribution.
3Temperature
If high pressure systems are used, then cooling performance is improved, but system cost increases due to expensive components and connections
Solution Approach 1:
The patent changes the operating pressure parameter to low pressure (less than 5 psi), which allows the use of standard, inexpensive connections and components rather than specialized high pressure parts. The cooling performance is maintained through optimized flow rate and direct contact cooling architecture.
Solution Approach 2:
The low pressure system allows the use of cheaper, easily replaceable connections and components that are not designed for high pressure applications. This reduces system cost and simplifies manufacturing while maintaining adequate cooling performance through optimized liquid flow and heat transfer surfaces.
4Temperature
If air flow fans are used to cool components, then cooling is provided, but additional heat is generated that must be removed
Solution Approach 1:
The patent replaces air flow fans with a direct liquid cooling system that contacts the components directly through channels and jackets. This substitution eliminates the need for air movement, thereby eliminating the heat generated by fans while providing more efficient heat removal through liquid-to-solid conduction.
Solution Approach 2:
The patent introduces liquid coolant as an intermediary between the heat-generating components and the heat dissipation system. This liquid intermediary provides direct thermal contact with components, efficiently transferring heat away without generating additional heat, unlike air fans which consume power and generate waste heat.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces energy consumption, minimizes the risk of leaks, and lowers operational costs by maintaining consistent liquid flow and pressure, independent of component additions or removals, while providing reliable and efficient cooling without the need for high-pressure pumps or expensive connections.
Implementation Method 1
The liquid flows through channels that are provided at locations adjacent to the electronic components to be cooled. Liquid flowing through the channels absorbs heat directly from the electronic components
Implementation Method 2
The liquid may be returned to the reservoir from which the coolant liquid was initially pumped in a closed loop system. The coolant liquid in the reservoir may be circulated to a coolant loop of a chiller or building coolant system
Data Source
AI summary
A cooling system for cooling computer component with a liquid provided at atmospheric pressure, or low pressure, that flows through channel defined in the computer component. The liquid is pumped from a reservoir to a discharge port, or weir, that is located above the computer component. The liquid flows through an in-feed manifold to diverters that direct the liquid into in-feed tanks located above a row of the computer component. The liquid flows through the channels and flow control orifices to a drain that returns the liquid to the reservoir.