Low Profile Encapsulation for Bonded Wires in Thermal Inkjet Printers
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Solution Overview
Problem
Conventional film encapsulation processes for thermal inkjet printers are complex, prone to peeling, and harbor trapped air, making it difficult to maintain a low profile encapsulation height near print head nozzles, which interferes with servicing and print quality.
Innovation Solution
A low profile encapsulation method using a bonded wire with a truncated shape formed by compressing or guiding the encapsulation material, ensuring the encapsulation height remains under a hundred microns, allowing closer proximity to print heads without interference during servicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional film encapsulation process is used, then encapsulation can be applied, but the encapsulation height becomes too high and the process becomes complex
Solution Approach 1:
The patent changes the physical state of encapsulation material from liquid film to solid bead form, fundamentally altering how the material is applied and shaped. This parameter change enables precise height control through bead size selection rather than complex film deposition processes
Solution Approach 2:
The patent uses disposable encapsulation beads that are placed once and then consumed/processed, eliminating the need for complex reusable film deposition equipment and multiple processing steps. Each bead is a self-contained encapsulation unit
2Length of stationary object
If film encapsulation is used to reduce height, then encapsulation height decreases, but peeling and trapped air issues occur
Solution Approach 1:
The patent changes the morphology of encapsulation material from thin film to spherical bead with controlled size parameters. This allows the bead to be compressed into a flat pancake shape that maintains structural integrity while achieving low height, eliminating peeling and air trapping issues
Solution Approach 2:
The encapsulation beads are pre-formed with controlled size and properties before placement. This preliminary preparation ensures that when compressed, they achieve the desired low profile shape without introducing defects like air pockets or peeling edges
3Length of stationary object
If encapsulation height is reduced to under hundred microns, then low profile is achieved, but servicing interference occurs
Solution Approach 1:
The patent creates local variation in encapsulation shape by compressing the bead into a pancake form with specific dimensional characteristics. The encapsulation has low height in the vertical direction (under 100 microns) while maintaining adequate lateral coverage, providing local optimization for both low profile and servicing access
4Area of stationary object
If encapsulation material is deposited to sufficient amount at base, then coverage is adequate, but height increases and interferes with servicing
Solution Approach 1:
The patent uses spherical encapsulation beads as the starting form, which when compressed become pancake-shaped with curved edges. This geometric transformation allows the material to spread laterally for adequate coverage while the compression controls the vertical height, resolving the contradiction between coverage area and height
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for a compact and reliable encapsulation that prevents interference with print head servicing, reduces trapped air issues, and enables more compact printer designs by maintaining a low encapsulation height, enhancing print quality and reducing manufacturing complexity.
Implementation Method 1
the encapsulation material is compressed to form a truncated shape
Data Source
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AI summary
Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.