Low-Profile Choke Manufacturing via Substrate Etching
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Solution Overview
Problem
Existing methods for making chokes are inefficient, producing a single inductor at a time and result in large sizes, making them unsuitable for miniaturization in portable electronic devices.
Innovation Solution
A process involving an etchable substrate with masking layers and etching to form recessed patterns, filled with magnetic and conductive materials, followed by slicing to create multiple low-profile choke bodies, enabling simultaneous production and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional wire winding and powder molding method is used, then the choke can be manufactured with simple process, but the productivity is low (single unit production) and the size is large (millimeter order)
Solution Approach 1:
The substrate is divided into multiple regions with different depths (first recessed pattern with deeper core recess portion, second recessed pattern with shallower coil recess portion), allowing simultaneous formation of multiple choke units with different structural requirements in a single substrate, thereby increasing productivity while maintaining compact size
Solution Approach 2:
The invention transitions from three-dimensional wire winding to two-dimensional planar patterning on a substrate. The coil structure is formed by depositing conductive material in a coil pattern within recessed regions, enabling mass production through printing/deposition techniques while achieving miniaturization through precise dimensional control in the planar domain
2Productivity
If traditional wire winding method is used, then the manufacturing process is simple, but only single unit can be produced at a time
Solution Approach 1:
Multiple choke units are integrated into a single substrate with shared structural elements. The substrate serves as a common base for multiple core recess portions and coil recess portions, allowing simultaneous manufacturing of multiple chokes through single-step deposition and sintering processes, thereby dramatically increasing productivity
Solution Approach 2:
The invention changes the manufacturing parameters from mechanical wire winding to material deposition processes. By controlling the depth, area, and pattern of recessed regions, different choke configurations can be achieved through parameter adjustment rather than mechanical manipulation, enabling automated mass production
3Volume of moving object
If larger size choke is used, then the manufacturing is easier, but it is unsuitable for miniaturization in portable devices
Solution Approach 1:
Different regions of the substrate are given different local qualities through varying recess depths. The core recess portion has greater depth than the coil recess portion, creating optimized local structures for magnetic core placement and coil winding respectively. This localized differentiation allows precise control of each functional region while maintaining overall compact dimensions
Solution Approach 2:
The invention replaces mechanical wire winding and manual assembly with automated material deposition techniques. Conductive material is deposited in predetermined coil patterns within recessed regions, and magnetic material is filled into core recess portions, eliminating the need for manual wire manipulation and enabling precise dimensional control through process parameters rather than mechanical tolerances
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process allows for the efficient production of multiple low-profile chokes with miniaturized thickness, suitable for portable electronic devices, and reduces direct current impedance, alleviating overheating issues.
Implementation Method 1
etching the etchable substrate through the first perforated patterns of the first masking layer to permit the etchable substrate to be formed with an array of first recessed patterns
Implementation Method 2
filling a magnetic material and a conductive material respectively into the first core recess portion and the first coil-patterned recess portion
Data Source
AI summary
A process for making a low-profile choke includes steps of: providing an etchable substrate; applying a masking layer on the etchable substrate; etching the etchable substrate through perforated patterns of the masking layer to permit the etchable substrate to be formed with an array of recessed patterns, each of which includes a core recess portion and a coil-patterned recess portion; filling a magnetic material and a conductive material respectively into the core recess portion and the coil-patterned recess portion of each of the recessed patterns to form in the etchable substrate a plurality of magnetic cores and a plurality of conductive coils; and slicing the etchable substrate to obtain a plurality of choke bodies.