Low-Profile Coil Component Structure for High Inductance
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Solution Overview
Problem
There is a challenge in reducing the thickness of coil components while maintaining high-capacity inductance and low direct-current (DC) resistance, as thinner coils face limitations in reducing the thickness of external electrodes, covers, and support substrates.
Innovation Solution
A coil component design that includes an insulating substrate with a coil portion embedded in a body, where the thickness ratio of the cover portion to the substrate satisfies 3<T2/T1<6, and the cover portion thickness is between 90 μm and 120 μm, allowing for high-capacity inductance and low DC resistance while being low profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the coil component is made thinner, then the profile height is reduced, but the inductance capacity and DC resistance performance deteriorate
Solution Approach 1:
The patent applies local quality by creating distinct regions within the body with different magnetic permeabilities. The first region (active portion) has higher magnetic permeability to concentrate magnetic flux and enhance inductance, while the second region has lower magnetic permeability. This spatial variation in material properties allows the component to achieve high inductance capacity in a compact, thin profile without compromising performance.
Solution Approach 2:
The patent employs composite materials by combining regions of different magnetic permeabilities within the same body structure. This composite approach enables the simultaneous achievement of high inductance (through high-permeability regions) and low profile (through optimized overall geometry with low-permeability regions), resolving the contradiction between size reduction and performance maintenance.
2Length of moving object
If the thickness of external electrodes, covers, and support substrates is reduced, then the overall component thickness decreases, but the structural integrity and electrical performance are compromised
Solution Approach 1:
The patent merges the functions of external electrodes, covers, and support substrates into an integrated body structure. The body simultaneously provides mechanical support, electrical connection pathways, and magnetic flux management. This integration eliminates the need for separate thick components, achieving reduced overall thickness while maintaining structural integrity through the unified design.
Solution Approach 2:
The body structure serves multiple functions simultaneously: it provides mechanical support (replacing separate substrates), establishes electrical connections (replacing external electrodes), and manages magnetic flux (replacing dedicated covers). This multi-functionality allows thickness reduction without compromising structural integrity, as a single optimized structure performs all necessary roles.
Data Source
AI summary
A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 μm<T2<120 μm.